A device for removing tool joint edge burrs of a wheel comprises a frame, a base, first guide rails, a first movable plate, a first ball screw, a longitudinal motor, a transverse motor, second guide rails, a second ball screw, a movable plate II, an electric cylinder, a mobile roller bed, a circle center measuring sensor, an inner bearing, a shaft, a sleeve, guide keys, a hollow shaft, a pyramid cutter, outer cylinders, a left blade, a right blade and the like. The device is configured to simultaneously remove tool joint edge burrs from an outer rim and a cap slot edge and is used for automatic continuous production; by integrating inner and outer burr removing cutters, not only is the space saved, but also inner and outer independent feeding and independent rotation are realized; the inner and outer cutters have higher coaxiality, and the burr removing effect is improved.

A grinding device includes a first arm including at a tip thereof at least one grinding member configured to grind a workpiece, the first arm causing at least one grinding member to reciprocate linearly, and a second arm including at a tip thereof a gripping part configured to grip the workpiece, the second arm causing the workpiece to rock through repetitive two-way rotations.

A machine for machining workpieces includes a movably mounted table (1) and at least one clamp (2). Each clamp is engageable with a workpiece and can be rotatably driven relative to the table. Each workpiece is transportable by movement of the table to a first workstation (3). Workstation 3 includes a toolholder (4) that holds a tool that is operative to machine a surface of the workpiece. The toolholder is movable in engagement with the workpiece by a feed unit (5) and the orientation of the tool holder relative to the workpiece is changeable by movement of an alignment unit (6). A second workstation to which the workpiece is moved after machining includes a cleaning device (8). A third workstation to which the workpiece is moved after cleaning includes a measuring device (10) that optically determines at least one surface property of the machined surface. The measuring device is in connection with an evaluation unit (14). The evaluation unit evaluates the at least one surface property and determines a direction and an order of magnitude that the alignment unit must be adjusted so at least one subsequently machined workpiece meets required tolerance specifications.

A design method of a semiconductor manufacturing apparatus which can satisfy a specification required by a user is disclosed. The design method of the semiconductor manufacturing apparatus includes creating a program setting file; creating a program installer from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of a requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing a program into a memory of a controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other.

A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current value of the swing shaft motor. While polishing the semiconductor wafer by causing the semiconductor wafer to swing around the swing center on the swing arm, a change of a frictional force between the polishing pad and the semiconductor wafer is detected by increasing a change amount of the first output.

There is provided a surfacing station for processing of surfaces of optical elements as workpieces, including a processing unit configured to process surfaces of optical elements; a controller unit configured to communicate with a database containing processing protocols, which can be carried out by the surfacing station, and to control operation of the processing unit in accordance with the processing protocols; and an identification tag base configured to communicate with the controller unit and configured to determine identification tags of consumable items used by the surfacing station, the controller unit being configured to enable a surfacing protocol for processing of the optical elements as workpieces in function of an identified consumable item.

There is provided a surfacing station for processing of surfaces of optical elements as workpieces, including a processing unit configured to process surfaces of optical elements; a controller unit configured to communicate with a database containing processing protocols, which can be carried out by the surfacing station, and to control operation of the processing unit in accordance with the processing protocols; and an identification tag base configured to communicate with the controller unit and configured to determine identification tags of consumable items used by the surfacing station, the controller unit being configured to enable a surfacing protocol for processing of the optical elements as workpieces in function of an identified consumable item.

Disclosed is a device for automatically removing burrs from a riser of an aluminum alloy wheel. The device is composed of a frame, a clamping gear rack structure, a support plate, a servo motor and the like. When a clamping cylinder drives a left sliding plate to move, clamping wheels are controlled to center and clamp the wheel, and the servo motor controls the rotation of the clamping wheels, so that the wheel may rotate while being clamped. When a distance adjusting cylinder drives a right sliding block to move, a left sliding block and the right sliding block move synchronously under the action of a feed gear rack structure, so that a left burr tool and a right burr tool move synchronously to adjust the distance between them according to the diameter of a cap slot.

A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

The present application discloses an exchanging double-station wheel burr removing device, comprising an exchange system, a left burr brushing system, clamping drive systems, a right burr brushing system. In practical use, the four V-shaped rollers lamp a wheel, the first servo motor drives the clamped wheel to rotate, and simultaneously, clamping drive system enables a right wheel to rotate; the drive motor drives the round brush and the outer ring brush to rotate; the first cylinders drive the rotating brushes to ascend, and the brushes in contact with the back cavity of the wheel can remove burrs; the first and second servo electric cylinder can drive the large brush to move, when the large brush are in contact with roots and corners of wheel flanges and rims, it can remove burrs; and the second servo motor can exchange the left burr brushing system with the right burr brushing system.