A cutting apparatus includes a chuck table for holding a workpiece thereon, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade secured in place on a distal-end portion of a spindle by a mount flange mounted on the distal-end portion of the spindle, an indexing feed unit for moving the cutting unit in indexing feed directions parallel to axial directions of the spindle, a processing feed unit for moving the chuck table in processing feed directions perpendicular to the indexing feed directions, and an end face correction unit for correcting an end face of the mount flange that supports the cutting blade in contact therewith. The processing feed unit includes a table moving base that supports the chuck table thereon and an actuating mechanism for moving the table moving base. The end face correction unit is fixedly mounted on the table moving base.

One exemplary embodiment relates to an installation and a method for processing ophthalmic lenses, with several processing devices for processing the lenses. The embodiment includes a conveying device connecting the processing devices for transporting lens carriers to and from the processing devices, and with a transfer device for changing transport tracks as required. According to the embodiment, it is provided that the processing devices are arranged in front of the first transport track and that the transfer device is designed as a pushing device with a fork-shaped guide device which guides the lens carriers laterally and in the direction of conveyance.

A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a consumable part when the consumable part moves away from the polishing pad, and a controller configured to perform an image processing algorithm on the image to determine whether the consumable part is damaged. The consumable part can be a retaining ring on a carrier head, or a conditioner disk on a conditioner head.

While the loading member supporting mechanism moves the loading member from the workpiece set state to the workpiece retracted state and returns to the workpiece set state again, the displacement drive unit and the rotation drive unit perform an operation of disposing the workpiece holding portion arranged at the processing position to the replacement position and an operation of disposing the workpiece holding portion disposed at the replacement position to the processing position in a trajectory in which the loading member does not interfere with the shoe.

A machine for working glass slabs includes a supporting structure, a slab grinding section having grinding heads, a conveyor assembly adapted to move the glass slab, and a slab drilling section having a conveyor adjacent to the conveyor assembly. The slab grinding section has suckers for keeping the glass slab next to a working plane spaced and/or offset with respect to the advancement plane, and a computerized numeric control assembly to perform workings on the glass slab.

An integrated device for grinding and polishing a diamond and a method thereof are provided. The integrated device for grinding and polishing the diamond comprises a base device and a grinding and polishing device, the base device comprises a base configured rotate around a Z-axis, the base comprises a fixture configured to clamp the diamond, the grinding and polishing device comprises a shaft disposed along the Z-axis, the outer polishing wheel surrounds the inner grinding wheel, the shaft drives the inner grinding wheel and the outer polishing wheel to rotate together, an upper and lower position relationship between the inner grinding wheel and the outer polishing wheel along the Z-axis is configured to be adjusted, and the diamond on the fixture is ground and polished by rotations of the inner grinding wheel and the outer polishing wheel, feeding, and a rotation of the base.

A grinding machine includes a machine bed on which a workpiece spindle with a workpiece holder and a tool spindle with a tool holder are arranged. A workpiece held in the workpiece spindle, relative to a tool held in the tool holder, is displaceable along an X-axis running in a first direction parallel to the surface of the machine bed, is displaceable along a Y-axis, running in a second direction parallel to the surface of the machine bed, is displaceable along a Z-axis running perpendicular to the surface of the machine bed, is rotatable about an A-axis running parallel to the surface of the machine bed, and is rotatable about a C-axis running perpendicular to the surface of the machine bed. The tool spindle is completely kinematically separated from the workpiece spindle. Movements along the X-axis, about the A-axis and about the C-axis being carried out by the workpiece spindle.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

The present invention relates to an apparatus for processing optical workpieces, having a working space, wherein workpiece spindles for receiving and holding the optical workpieces and tool spindles with processing tools receivable thereon for processing the optical workpieces are arranged in the working space, wherein the tool spindles are arranged rotatably about their center axis, wherein the tool spindles are arranged linearly movably along their center axes. It is provided that at least two pairs of tool spindles are provided, that at least one device for rotational drive is provided for the at least two pairs of tool spindles, that at least one device for linear drive is provided for the at least two pairs of tool spindles along their center axes. The present invention further relates to a method for processing optical workpieces.