A glass-ceramic article includes at least one substrate, such as a plate, made of glass-ceramic, the substrate having a face including a microtexturing such that the arithmetic mean surface roughness Ra, measured according to standard ISO 4287, is between 0.14 and 0.40 μm, and the total roughness, Rt, measured according to standard ISO 4287, is between 1.15 and 5.00 μm.

A system for polishing a surface of a component includes a motorized apparatus including a body, a drive system coupled to the body, and an arm including a proximal end coupled to the body and a distal end opposite the proximal end. The motorized apparatus further includes a tool coupled to the distal end of the arm. The tool is configured to polish the surface of the component. The motorized apparatus also includes an actuator coupled to the arm. The system also includes a controller configured to position the tool relative to the component by positioning at least one of the body and the arm relative to the component to reach the target area on the component while maintaining a distance between the tool and the body that is less than a threshold distance. The threshold distance is less than a full reach of the arm and is determined to prevent vibrations of the tool and the arm from exceeding a predefined level.

The present disclosure discloses a device for cutting connection of multi-piece module electrode which includes a stand, the stand is provided with a workbench and the workbench is connected with a height adjusting device. The device further includes an angle grinding device, the angle grinding device includes a polishing shaft and an angle grinder, the angle grinder is arranged on the polishing shaft, and the angle grinding device is provided with a saw blade. According to the characteristics of the module electrode, the angle grinding device is matched with the workbench to implement simultaneous electrode disconnecting operation of multiple electrodes of the module, so that the device not only has higher efficiency and better cutting effect, but also is suitable for universal saw blades, saves the cost, and is safer.

A method for producing a roll grinder with two running rollers, a handle body arranged between the running rollers and can be rotated relative thereto, and at least one grinding or polishing surface. The method includes steps of: producing the handle body; measuring the handle body in order to determine the actual dimensions of the handle body; providing at least two differently dimensioned types of spacer elements, by means of each of which a different distance can be set between one of the running rollers and the handle body in the installed state of the roll grinder compared to at least one other type; selecting one of the types of spacer elements provided depending on the measured dimension of the handle body; and connecting the handle body to the running rollers to form the roll grinder while using at least one spacer element of the type selected.

An integrated device for grinding and polishing a diamond and a method thereof are provided. The integrated device for grinding and polishing the diamond comprises a base device and a grinding and polishing device, the base device comprises a base configured rotate around a Z-axis, the base comprises a fixture configured to clamp the diamond, the grinding and polishing device comprises a shaft disposed along the Z-axis, the outer polishing wheel surrounds the inner grinding wheel, the shaft drives the inner grinding wheel and the outer polishing wheel to rotate together, an upper and lower position relationship between the inner grinding wheel and the outer polishing wheel along the Z-axis is configured to be adjusted, and the diamond on the fixture is ground and polished by rotations of the inner grinding wheel and the outer polishing wheel, feeding, and a rotation of the base.

The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.

Apparatuses and associated methods for polishing side surfaces of fibers. The system includes a fiber loading mechanism for securing a fiber to the apparatus, a polishing mechanism, and a linear motion mechanism for linearly translating one of the polishing mechanism and the fiber for polishing a side surface of the fiber using the polishing mechanism.

The present disclosure discloses an integrated rotary cutting tool manufacturing device and method, the integrated rotary cutting tool manufacturing device comprises a workpiece transfer device, a machine body, a feeding device, grinding devices and a discharge device. The grinding devices comprise a rough grinding device used for carrying out primary grinding on a vertically arranged workpiece and a fine grinding device used for carrying out secondary grinding on the vertically arranged workpiece. The integrated rotary cutting tool manufacturing device is adopted by the rotary cutting tool manufacturing method. The device according to the present disclosure is compact in structure, high in machining efficiency and precision, and low in costs, the maximum values, the minimum values and the average values of the roundness and the concentricity of machined micro drill bits are closer to the standard values, and the stabilization process capability indexes of the roundness.

A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.

A finger includes a pair of overhanging portions that project out laterally from a main body portion. Outer peripheral surfaces of the overhanging portions are made up from five surfaces including upper surfaces, side surfaces, lower surfaces, first end surfaces, and second end surfaces. Crowning is applied to the intersections between these surfaces.