Patent classifications
B24B27/0076
Method for double-side polishing wafer
A method for double-side polishing a wafer uses a double-side polishing machine wherein a carrier which is yet to be arranged in the double-side polishing machine is previously subjected to two-stage double-side polishing which uses a double-side polishing machine different from the double-side polishing machine adopted for double-side polishing the wafer and includes primary polishing using slurry containing abrasive grains and secondary polishing using an inorganic alkali solution containing no abrasive grain, the carrier subjected to the two-stage double-side polishing is arranged in the double-side polishing machine adopted for double-side polishing the wafer, and the double-side polishing of the wafer is performed. Consequently, the method for double-side polishing a wafer enables suppressing damages to wafers to be polished immediately after arranging the carrier between the upper and lower turntables.
Apparatus for metal-cutting machining of wear-affected bit holders of road milling machines, and use of an apparatus for overhauling such wear-affected bit holders
An apparatus for metal-cutting machining of wear-affected bit-head-proximal end regions of bit holders of road milling machines encompasses: a rotary actuator having an output member rotating around an actuator rotation axis; at least one material-removing tool, rotatable around a tool rotation axis, which is coupled or couplable to the output member so as to rotate together; a positioning arbor, extending along an arbor axis, which is embodied for introduction into a bit receptacle opening of a bit holder and which comprises an abutment segment, located radially remotely from the arbor axis and facing away from the arbor axis in a direction having a radial component, which is embodied for abutment against an inner wall of the bit receptacle opening. A material-removing region, populated with cutting edges, of the material-removing tool is arranged between the positioning arbor and the output member.
Reduced-vibration surface treatment device
A vibration-reducing component and an apparatus for its use. The vibration-reducing component combines an elastic member with a compression element to both resist applied forces and absorb selected vibrations. The vibration reducing component finds particular utility in tools that inherently create vibrations.
High throughput polishing system for workpieces
A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.
APPARATUS AND METHOD FOR PROCESSING OPTICAL WORKPIECES
The present invention relates to an apparatus for processing optical workpieces, having a working space, wherein workpiece spindles for receiving and holding the optical workpieces and tool spindles with processing tools receivable thereon for processing the optical workpieces are arranged in the working space, wherein the tool spindles are arranged rotatably about their center axis, wherein the tool spindles are arranged linearly movably along their center axes. It is provided that at least two pairs of tool spindles are provided, that at least one device for rotational drive is provided for the at least two pairs of tool spindles, that at least one device for linear drive is provided for the at least two pairs of tool spindles along their center axes. The present invention further relates to a method for processing optical workpieces.
WATER-BASED GRINDING MACHINE FOR POLISHING SURFACE OF A METAL STRIP
A water-based grinding machine for polishing a surface of a metal strip includes an unwinding wheel, a polishing mechanism, a cleaning mechanism, a drying mechanism and a winding wheel. The polishing mechanism includes a first polishing wheel and a first workbench. The metal strip is drawn from the unwinding wheel into a gap between a polishing wheel and a pad, and then is drawn to the cleaning mechanism. The cleaning mechanism includes a third workbench and a cleaning liquid storage tank. At least one pair of felt wheels is arranged above the third workbench. The metal strip passes through a gap between the at least one pair of felt wheels. An outer circumference of the at least one pair of felt wheels is covered with a wool layer. The cleaning liquid storage tank is provided with a cleaning pipe. The drying mechanism includes an oven.
Planetary reform roller and method of reforming a vessel cavity
A device for reforming a vessel cavity is provided that includes a central shaft, a central gear coupled to the central shaft, and a plurality of roller gears coupled to the central gear, with each of the plurality of roller gears having a central portion. A proximal support member couples the plurality of roller gears and at least one of the central gear and the central shaft. A plurality of rollers is also provided, each of the plurality of rollers connected to the central portion of each of the plurality of roller gears. In one form, at least one idler member is disposed between the plurality of rollers. A distal support member couples the plurality of rollers and at least one of the central gear and a translation member. Also, a stationary member is secured to a distal portion of the vessel cavity.
Automatic Polishing System
In an automatic polishing system configured such that under control of a polishing robot and/or a polishing tool by a polishing controller, the polishing tool provides a polishing action on a polishing subject face, a color intensity measurement instrument is provided for measuring an intensity of a specified color in the polishing subject face. Based on the intensity of the specified color measured by this color intensity measurement instrument, the polishing controller controls the polishing robot and/or the polishing tool, so that an amount of polishing work by the polishing tool onto the polishing subject face is adjusted according to the intensity of the specified color.
METHOD AND APPARATUS FOR ABRADING IRREGULAR SURFACES
A system for abrading irregular surfaces includes a bracket that can be attached to a shop aid. The bracket carries two motors to which abrasive pads are attached, and the positions of the motors are controlled to move abrasive elements over the surface to be abraded. The abrasive pads are attached to abrasive-pad backing of different configurations. Disclosed configurations are generally flat, triangular, and U-shaped.
METHOD FOR MANUFACTURING OF A ROTOR
A method for manufacturing a rotor includes the following operations: the clamping of a workpiece in a grinding machine; the performance of one or more cylindrical grinding operations whereby a rotor shaft section is ground to the desired diameter with a cylindrical grinding disk; the performance of one more profile grinding operations whereby a rotor body is profiled with a profile grinding disk. During the manufacture of the rotor in the grinding machine, the workpiece is not undamped and the cylindrical grinding operations and the profile grinding operations are done with the same grinding machine.