A wire saw apparatus including: a plurality of wire guides; a wire row formed of a wire which is wound around the plurality of wire guides and configured to reciprocatively travel in an axial direction; a nozzle configured to supply a coolant or slurry to the wire; a workpiece-holding portion configured to suspend and hold a workpiece plate having a workpiece bonded thereto with a beam interposed therebetween; a workpiece-feeding mechanism configured to press the workpiece against the wire row; and a mechanism configured to adjust a parallelism of axes of the plurality of wire guides around which the wire row is formed. Thereby, a wire saw apparatus and a method for manufacturing a wafer are provided which enable manufacturing of a wafer having any warp shape by controlling a warp in a wire travelling direction of a sliced workpiece.

The present disclosure relates to a cutting machine comprising a rotating cutting wheel for performing separating cuts in a workpiece, and also relates to a workpiece positioning device for such a cutting machine. The cutting machine comprises a cutting wheel and a drive motor for driving the cutting wheel, a clamping means for clamping the workpiece, means for mechanically positioning the workpiece along one or two translational directions and additionally about one or two rotation axes, and a lifting mechanism for setting the cutting wheel on the workpiece to perform separating cuts in the positioned workpiece using the cutting wheel.

The present disclosure relates to a cutting machine comprising a rotating cutting wheel for performing separating cuts in a workpiece, and also relates to a workpiece positioning device for such a cutting machine. The cutting machine comprises a cutting wheel and a drive motor for driving the cutting wheel, a clamping means for clamping the workpiece, means for mechanically positioning the workpiece along one or two translational directions and additionally about one or two rotation axes, and a lifting mechanism for setting the cutting wheel on the workpiece to perform separating cuts in the positioned workpiece using the cutting wheel.

A pipe coating removal apparatus (1) for removing all or some of the coating on a pipe, the pipe coating removal apparatus (1) having a pipe support means (2) for supporting a length of pipe. and further having a tool carriage (3). The tool carriage (3) being capable of supporting two or more different types of pipe coating removal tools (4), (5), (6), (7), (8), (80), (81), (82) and/or (70). The pipe coating removal apparatus (1) being capable of causing relative movement between the tool carriage (3) and the pipe support means (2) to remove all or some of the coating on the pipe that is supportable by the pipe support means (2).

The present invention aims at eliminating a need for a protective cover such as a bellows cover and improving a collection rate of machining scraps, and includes machining tables that are fixed at least in X and Y directions on a horizontal plane and hold a workpiece, a machining mechanism that machines the workpiece with a rotary tool using a machining liquid, a moving mechanism that linearly moves the machining mechanism at least in each of the X and Y directions on the horizontal plane, and a machining scrap storage unit that is provided below the machining tables and stores machining scraps generated by machining by the machining mechanism.

The present invention aims at eliminating a need for a protective cover such as a bellows cover and improving a collection rate of machining scraps, and includes machining tables that are fixed at least in X and Y directions on a horizontal plane and hold a workpiece, a machining mechanism that machines the workpiece with a rotary tool using a machining liquid, a moving mechanism that linearly moves the machining mechanism at least in each of the X and Y directions on the horizontal plane, and a machining scrap storage unit that is provided below the machining tables and stores machining scraps generated by machining by the machining mechanism.

An evaluation method of abrasive grains used in an ingot-cutting slurry includes: an evaluation solution preparation step in which abrasive grains including polishing grains and impurities are dissolved in a solvent to prepare an evaluation solution; a sedimentation step in which a container containing the evaluation solution is left still to settle the polishing grains; a measurement step in which a turbidity of supernatant of the evaluation solution is measured using the measurement device; and an estimation step in which an amount of the impurities is estimated based on the measurement result of the turbidity of the supernatant.

An evaluation method of abrasive grains used in an ingot-cutting slurry includes: an evaluation solution preparation step in which abrasive grains including polishing grains and impurities are dissolved in a solvent to prepare an evaluation solution; a sedimentation step in which a container containing the evaluation solution is left still to settle the polishing grains; a measurement step in which a turbidity of supernatant of the evaluation solution is measured using the measurement device; and an estimation step in which an amount of the impurities is estimated based on the measurement result of the turbidity of the supernatant.

A saw blade for dicing a sheet of copper alloy to form individual resistors is disclosed, wherein the sheet of copper alloy has a thickness of less than 0.3 mm. The saw blade includes a ring having a first side, a second side, and a circumferential surface, wherein the thickness of the ring between the first side and the second side is less than 0.6 mm.

A saw blade for dicing a sheet of copper alloy to form individual resistors is disclosed, wherein the sheet of copper alloy has a thickness of less than 0.3 mm. The saw blade includes a ring having a first side, a second side, and a circumferential surface, wherein the thickness of the ring between the first side and the second side is less than 0.6 mm.