A device for cutting a mat or panel made of mineral wool or a board or panel made of porous construction material, including a system for moving the mat or panel made of mineral wool or the board or panel made of porous construction material, which includes at least one conveyor, capable of moving along a direction, an endless diamond element designed to cut the mat or panel made of mineral wool or the board or panel made of porous construction material, a device for running the endless diamond element in a direction perpendicular to the direction of movement of the mat or panel made of mineral wool or the board or panel made of porous construction material, the endless diamond element being an endless diamond wire, an endless diamond cable or an endless diamond strip.

A device for cutting a mat or panel made of mineral wool or a board or panel made of porous construction material, including a system for moving the mat or panel made of mineral wool or the board or panel made of porous construction material, which includes at least one conveyor, capable of moving along a direction, an endless diamond element designed to cut the mat or panel made of mineral wool or the board or panel made of porous construction material, a device for running the endless diamond element in a direction perpendicular to the direction of movement of the mat or panel made of mineral wool or the board or panel made of porous construction material, the endless diamond element being an endless diamond wire, an endless diamond cable or an endless diamond strip.

A power tool is provided with a coating to distribute static electricity away from the surface of the handle of the tool. The tool includes a handle configured to be grasped by a user. The handle includes a surface and a first material having a first surface resistivity. The tool includes a coating covering at least a portion of the handle. The coating is configured to distribute static electricity away from the surface. The coating is made of a second material having a second surface resistivity less than the first surface resistivity.

A silicon carbide ingot is cut using a wire. The silicon carbide ingot has a polytype of 4H—SiC. The silicon carbide ingot includes a top surface, a bottom surface opposite to the top surface, and a side surface between the top surface and the bottom surface. A direction from the bottom surface toward the top surface is a direction parallel to a [0001] direction or a direction inclined by less than or equal to 8° relative to the [0001] direction. In the cutting of the silicon carbide ingot, the silicon carbide ingot is cut from the side surface at a (000-1) plane side along a straight line parallel to a direction within ±5° relative to a direction that bisects an angle formed by a [1-100] direction and a [11-20] direction when viewed in the direction from the bottom surface toward the top surface.

A cutting apparatus includes: a processing feeding unit that performs processing feeding of a chuck table adapted to hold a workpiece; and two cutting units in which rotational axes of two spindles coincide with each other and cutting blades mounted to the spindles face each other. Each cutting unit includes a flange mechanism in which the cutting blade having a cutting edge fixed to an outer peripheral edge of a one-side outer surface of a circular disk-shaped base is fixed to the spindle. The flange mechanism is fixed to a tip of the spindle, sucks an other-side outer surface of the base of the cutting blade, and fixes the cutting blade to the spindle with the one-side outer surface of the base exposed to the side of the tip of the spindle, and the one-side outer surfaces of the cutting blades fixed to the two cutting units.

A method of manufacturing a hexagonal Group-III nitride semiconductor plate crystal using a crystal cutting wire. where the hexagonal semiconductor crystal has one principal face on one side and another principal face on an opposite side, and the hexagonal semiconductor crystal is cut by causing the crystal cutting wire to move so as to (i) divide the one principal face and the another principal face and (ii) satisfy conditions of Expressions (A) and (B):

25°<α≤90°  Expression (A); and

β=90°±5°  Expression (B) where α represents an angle formed by a c axis of the hexagonal Group-III nitride semiconductor crystal and a normal line of a crystal face cut out by the wire, and β represents an angle formed by a reference axis, which is obtained by perpendicularly projecting the c axis of the hexagonal Group-III nitride semiconductor crystal to the crystal face cut out by the wire, and a cutting direction.

Particular embodiments of the inventive technology relate to apparatus and methods for cutting multi-layered material to reconfigure it so it may be used to construct sub-compartments in a larger storage container. The inventive technology, in particular embodiments may feature one or more of the following: dual blades, “staggered” blades (where one blade is more forward than another), a blade(s) angled upwards and forwards, blades separated in a left-right direction, prong recesses to accept trailing tips of blades, a rearwardly angled handle and/or a removed material ejection ramp, in conjunction perhaps with other features such as, e.g., a guide prong. One or more of such features may appear in the various manifestations of a defluting cutter or through cutting apparatus, whether guided or unguided, and/or manual or powered.

Particular embodiments of the inventive technology relate to apparatus and methods for cutting multi-layered material to reconfigure it so it may be used to construct sub-compartments in a larger storage container. The inventive technology, in particular embodiments may feature one or more of the following: dual blades, “staggered” blades (where one blade is more forward than another), a blade(s) angled upwards and forwards, blades separated in a left-right direction, prong recesses to accept trailing tips of blades, a rearwardly angled handle and/or a removed material ejection ramp, in conjunction perhaps with other features such as, e.g., a guide prong. One or more of such features may appear in the various manifestations of a defluting cutter or through cutting apparatus, whether guided or unguided, and/or manual or powered.

According to an aspect of the present disclosure, a low profile travelling pipe cutter is provided which is adapted to perform at least one of cutting and beveling a hollow vessel while traveling around the vessel using a cutting tool mounted thereon. The pipe cutter includes inner and outer carriages, a capstan assembly attached to the outer carriage to which a feed cable is attached, and rollers attached to the outer carriage to which a tension cable is attached. The force adjustment assembly changes the vertical position of the outer carriage relative to the inner carriage to compensate for the pipe cutter going inwardly and outwardly as it travels around a hollow vessel in order to maintain constant pressure caused by the lever tension interface. A guard assembly is provided for covering and uncovering the cutting tool during cutting.

An electronic component removal device comprising a cutting wire routed through a cutting region configured to receive an electronic component coupled to a substrate. The electronic component removal device can also include a leading actuator coupled to a leading end of the cutting wire to cause movement of the cutting wire in a cutting direction at a cutting speed. The electronic component removal device can further include a trailing resistance device coupled to a trailing end of the cutting wire to resist movement of the cutting wire in the cutting direction with a variable resistance. In addition, the electronic component removal device can include a leading tension sensor to sense a leading tension in the cutting wire between the cutting region and the leading actuator. The trailing resistance device can resist movement of the cutting wire with a resistance that varies based on the leading tension in the cutting wire.