A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

A method of manufacturing a window may include cutting a window having a uniform thickness of about 20 μm to about 100 μm and polishing a cut surface of the window with a polishing pad having an elastic modulus less than an elastic modulus of the window while applying slurry to the cut surface of the window.

An air cylinder that changes the posture of an automatic wet sanding unit main body having sandpaper mounted thereon is provided with a guide rod, and an outer circumferential surface of the guide rod has grooves that extend along a shaft centerline of the guide rod and have an arc-shaped cross-section. Balls are interposed between a bottom of each groove and an inner surface of a bush that is provided inside the air cylinder. Thus, it is possible to make two objects compatible with each other: to achieve high-accuracy automatic wet sanding by enhancing the adaptability of the sandpaper to the shape of a painted surface through a reduction of the diameter of the piston rod; and to enhance the durability of the automatic wet sanding apparatus.

In an automatic wet sanding apparatus including a paper peeling unit that has a clamping shaft and a clamping hook, an inclination angle of a leading end surface of the clamping hook is equal to an inclination angle of an outer circumferential surface of a cushion pad at the start of a paper peeling step. Thus, the leading end surface of the clamping hook comes into contact with an outer circumferential end of a disc at the same time as coming into contact with the outer circumferential surface of the cushion pad, so that the cushion pad is less likely to get caught due to deformation of the outer circumferential surface and its peripheral part of the cushion pad. It is therefore possible to appropriately remove the sandpaper from the cushion pad and stably perform the task of removing the sandpaper.

A flexible emitting light device production apparatus of the present disclosure includes: a stage (520) for supporting a flexible emitting light supporting substrate (10), the flexible display supporting substrate including a glass base (11) and a synthetic resin film (12) provided on the glass base; a polisher head (535) configured to approach a selected region of a surface (12s) of the synthetic resin film (12) and polish the region so that a polish recess (12e) is formed in the surface (12s); and a repair head (536) for supplying a liquid material (20a) to the polish recess (12c) formed in the surface (12s) of the synthetic resin film (12) and heating the liquid material (20a), thereby forming a sintered layer (20) from the liquid material (20a).

A flexible emitting light device production apparatus of the present disclosure includes: a stage (520) for supporting a flexible emitting light supporting substrate (10), the flexible display supporting substrate including a glass base (11) and a synthetic resin film (12) provided on the glass base; a polisher head (535) configured to approach a selected region of a surface (12s) of the synthetic resin film (12) and polish the region so that a polish recess (12e) is formed in the surface (12s); and a repair head (536) for supplying a liquid material (20a) to the polish recess (12c) formed in the surface (12s) of the synthetic resin film (12) and heating the liquid material (20a), thereby forming a sintered layer (20) from the liquid material (20a).

Disclosed is a rocker type polishing apparatus and method for full-aperture deterministic polishing of a planar part. The apparatus includes a control system, a substrate, a lifting plate, a polishing module and a measuring module. The polishing module and the measuring module are arranged on the substrate. The lifting plate is arranged between the polishing module and the measuring module. The polishing module includes a rocker mechanism, a polishing pad surface dressing mechanism, a polishing pad surface profile measuring apparatus and a continuous polishing pad mechanism. Considering the specific surface profile of the planar part, the present invention makes the material removal rate distribution of the planar part and the surface profile of the planar part be in the normalized mirror symmetry relationship by controlling the material removal rate distribution on the surface of the planar part, thereby implementing the deterministic polishing of the planar part and ensuring the efficient convergence of the surface profile of the planar part in the polishing process. The present invention completes the high-precision polishing process by using the low-cost operation manner, thereby reducing the device cost.

Disclosed is a rocker type polishing apparatus and method for full-aperture deterministic polishing of a planar part. The apparatus includes a control system, a substrate, a lifting plate, a polishing module and a measuring module. The polishing module and the measuring module are arranged on the substrate. The lifting plate is arranged between the polishing module and the measuring module. The polishing module includes a rocker mechanism, a polishing pad surface dressing mechanism, a polishing pad surface profile measuring apparatus and a continuous polishing pad mechanism. Considering the specific surface profile of the planar part, the present invention makes the material removal rate distribution of the planar part and the surface profile of the planar part be in the normalized mirror symmetry relationship by controlling the material removal rate distribution on the surface of the planar part, thereby implementing the deterministic polishing of the planar part and ensuring the efficient convergence of the surface profile of the planar part in the polishing process. The present invention completes the high-precision polishing process by using the low-cost operation manner, thereby reducing the device cost.

A method of operating a dental polishing apparatus is provided, having a polishing unit driven by a dental machine tool. The polishing unit includes a circular polishing core and a circular polishing assembly particularly surrounding the polishing core. The polishing assembly also has a workpiece to be polished and the polishing assembly deforms elastically when in contact with the workpiece. A numerically controlled steering device moves the polishing assembly along a trajectory on and relative to the workpiece. The workpiece is immersed into the polishing assembly with a constant or substantially constant degree of immersion. The controller adjusts the degree of immersion based on process parameters.