In an automatic wet sanding apparatus including a paper peeling unit that has a clamping shaft and a clamping hook, an inclination angle of a leading end surface of the clamping hook is equal to an inclination angle of an outer circumferential surface of a cushion pad at the start of a paper peeling step. Thus, the leading end surface of the clamping hook comes into contact with an outer circumferential end of a disc at the same time as coming into contact with the outer circumferential surface of the cushion pad, so that the cushion pad is less likely to get caught due to deformation of the outer circumferential surface and its peripheral part of the cushion pad. It is therefore possible to appropriately remove the sandpaper from the cushion pad and stably perform the task of removing the sandpaper.

In an automatic wet sanding apparatus including a disc and a cushion pad, a disc center hole is formed at a central portion of the disc and a pad center hole is formed at a central portion of the cushion pad. Water having been supplied to an introduction space inside a skirt is stirred as an eccentric head rotates eccentrically and thereby pushed out toward a painted surface via the disc center hole and the pad center hole with enhanced pressure. Thus, sanding dust resulting from automatic wet sanding can be washed away toward an outer circumferential side by the water that is pushed out toward the outer circumferential side, so that the likelihood of clogging due to sanding dust can be reduced and high sanding efficiency can be maintained.

In an automatic wet sanding apparatus including a disc and a cushion pad, a disc center hole is formed at a central portion of the disc and a pad center hole is formed at a central portion of the cushion pad. Water having been supplied to an introduction space inside a skirt is stirred as an eccentric head rotates eccentrically and thereby pushed out toward a painted surface via the disc center hole and the pad center hole with enhanced pressure. Thus, sanding dust resulting from automatic wet sanding can be washed away toward an outer circumferential side by the water that is pushed out toward the outer circumferential side, so that the likelihood of clogging due to sanding dust can be reduced and high sanding efficiency can be maintained.

An automatic wet sanding apparatus is equipped with a suction unit having a suction nozzle that is located under an automatic wet sanding unit in a state where automatic wet sanding is performed and a suction device that generates a suction force for suctioning water through the suction nozzle, so that water having been used for automatic wet sanding can be suctioned through the suction nozzle. This can significantly reduce the amount of water containing sanding dust that flows down a painted surface under the suction nozzle, and thereby reduce the amount of sanding dust that remains on the painted surface after completion of automatic wet sanding. As a result, it is possible to achieve a quality finish on the painted surface while eliminating the need for the troublesome task of wiping off remaining sanding dust.

An air cylinder that changes the posture of an automatic wet sanding unit main body having sandpaper mounted thereon is provided with a guide rod, and an outer circumferential surface of the guide rod has grooves that extend along a shaft centerline of the guide rod and have an arc-shaped cross-section. Balls are interposed between a bottom of each groove and an inner surface of a bush that is provided inside the air cylinder. Thus, it is possible to make two objects compatible with each other: to achieve high-accuracy automatic wet sanding by enhancing the adaptability of the sandpaper to the shape of a painted surface through a reduction of the diameter of the piston rod; and to enhance the durability of the automatic wet sanding apparatus.

A flexible emitting light device production apparatus of the present disclosure includes: a stage (520) for supporting a flexible emitting light supporting substrate (10), the flexible display supporting substrate including a glass base (11) and a synthetic resin film (12) provided on the glass base; a polisher head (535) configured to approach a selected region of a surface (12s) of the synthetic resin film (12) and polish the region so that a polish recess (12c) is formed in the surface (12s); and a repair head (536) for supplying a liquid material (20a) to the polish recess (12c) formed in the surface (12s) of the synthetic resin film (12) and heating the liquid material (20a), thereby forming a sintered layer (20) from the liquid material (20a).

A flexible emitting light device production apparatus of the present disclosure includes: a stage (520) for supporting a flexible emitting light supporting substrate (10), the flexible display supporting substrate including a glass base (11) and a synthetic resin film (12) provided on the glass base; a polisher head (535) configured to approach a selected region of a surface (12s) of the synthetic resin film (12) and polish the region so that a polish recess (12c) is formed in the surface (12s); and a repair head (536) for supplying a liquid material (20a) to the polish recess (12c) formed in the surface (12s) of the synthetic resin film (12) and heating the liquid material (20a), thereby forming a sintered layer (20) from the liquid material (20a).

To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m.sup.2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.

To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m.sup.2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.

A sputtering target that is less likely to cause abnormal discharge is manufactured. A method for manufacturing a sputtering target includes performing multi-stage polishing on a sputtering surface of a target material having a Vickers hardness of 100 or less being made of metal by using a plurality of abrasives having different grit numbers in ascending order of grit number from a small grit number to a large grit number.