This document discloses a system and method for polishing a metal surface, using a grinding machine and a burnishing machine. The grinding machine comprises an arm coupled with a grinding wheel for grinding the internal surface of a workpiece, an arm rotation drive block configured to drive rotation of the arm around its longitudinal axis, an arm movement drive block configured to move the arm longitudinally and vertically, and rollers for rotating the workpiece around its cylindrical axis via friction with an external surface of the workpiece. The arm comprises a fixed main shaft, a universal joint shaft and a head section coupled with the grinding wheel, wherein the head section is configured to oscillate vertically, allowing the grinding wheel to follow up-and-down fluctuations of the workpiece. The burnishing machine is configured to tumble the workpiece including a tumbling detergent and tumbling beads therein.

A method of processing a surface in additive manufacturing includes assembling a structure for a component by additive manufacturing out of a bed of a powdery base material, such that the structure is provided with an internal surface and a powdery base material covers at least a part of the internal surface, and actuating the base material relatively to the structure such that the internal surface is mechanically processed by the base material.

A method of altering an additively manufactured part can include orienting a surface of the additively manufactured part toward a rotational center that may be independent of a rotational axis defined by the additively manufactured part, flowing an abrasive media past the surface, rotating the additively manufacturing part about the rotational center; urging abrasive particles in the abrasive media past the surface abrasive media to impinge the surface with centrifugal force generated by the rotating, and improving surface finish of the surface.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Aspects of the present disclosure are presented for techniques in removing roughness and surface anomalies in structures with internal passages and intricate external surfaces, such as structures with internal fluid passages constructed by additive manufacturing (AM), using an abrasive slurry. Post processing methods which are capable of smoothing non-uniform surface roughness within intricate fluid passages are a prerequisite to the widespread adoption of AM for complex fluid systems. In some embodiments, a mixture of abrasive powder and deionized (DI) water is used to create a viscous slurry which can then be pumped through the internal fluid passages of a workpiece until the desired surface roughness is achieved. This abrasive flow machine (AFM) is capable of smoothing a wide range of roughnesses, internal geometries, and printable materials.

Disclosed herein is a method for inner surface finishing of a workpiece, in which the inner surface of the workpiece defines an opening with axial symmetry around the longitudinal axis of the workpiece. The method may include the following steps. An abrasive medium may be poured inside the opening; urging the abrasive medium to rotate about the longitudinal axis, thereby imposing a centrifugal force on the abrasive medium to accelerate the abrasive medium outwards from the center of rotation towards the inner surface of the opening, where the abrasive medium impacts the inner surface of the opening; and the workpiece may be rotated about the longitudinal axis in a direction opposite the first direction, concurrently.

A three dimensional (3D) definition of a build piece, from which a build plan has been derived, is received. The computer system generates, based on the 3D definition, a processing plan that includes a plurality of robotic instructions to successively orient a build piece created by an additive manufacturing process into successive orientations. The computer system outputs the processing plan for use by a robotic controller.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

The present subject matter relates to a method and an apparatus in the form of a machine system (1200) for machining a component (100) with an internal passage (115). In an aspect, the method comprises periodically injecting 5 abrasive slurry back and forth through the internal passage (115) at a pressure ranging from about 25 bar to about 35 bar. The abrasive slurry comprises a mixture of abrasive particles having a size in the range of about 40 m to about 60 m, and a slurry medium. The volume fraction of the abrasive particles in the slurry medium is about 40% to about 50%. Further, the injection of the abrasive 10 slurry is performed for a predefined number of process cycles at predetermined time versus pressure changes to obtain the component having a final average surface roughness of less than about 3.0 m.

A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.