Provided is a machining apparatus capable of improving the positioning accuracy of a machining tool as compared to conventional machines. A machining apparatus 1 includes a rotating tool, a machining tool provided on an outer periphery of the rotating tool, and a spindle head adapted to rotatably support the rotating tool. The machining apparatus includes a driving portion configured to move the spindle head in a direction perpendicular to an axis of rotation R of the rotating tool, a position sensor configured to measure a position of the spindle head on a plane perpendicular to the axis of rotation R, and a control unit configured to control the driving portion so as to move the machining tool in a direction perpendicular to the axis of rotation R of the rotating tool on the basis of the position of the spindle head.

Provided is a machining apparatus capable of improving the positioning accuracy of a machining tool as compared to conventional machines. A machining apparatus 1 includes a rotating tool, a machining tool provided on an outer periphery of the rotating tool, and a spindle head adapted to rotatably support the rotating tool. The machining apparatus includes a driving portion configured to move the spindle head in a direction perpendicular to an axis of rotation R of the rotating tool, a position sensor configured to measure a position of the spindle head on a plane perpendicular to the axis of rotation R, and a control unit configured to control the driving portion so as to move the machining tool in a direction perpendicular to the axis of rotation R of the rotating tool on the basis of the position of the spindle head.

A bore finishing tool has an arbor with a tapered outer circumferential surface and a sleeve over the arbor having a tapered inner circumferential surface cooperatively disposed in surface to surface overlaying relation to at least a substantial portion of the tapered outer circumferential surface of the arbor. The sleeve is adjustably movable relative to the arbor for expanding a diametrical extent of the sleeve and has a plurality of internal material relief features at circumferentially spaced locations in the tapered inner circumferential surface extending partially through the sleeve so as to reduce a level of force required for expanding the diametrical extent of the sleeve. Exemplary material relief features include flutes and fractures. The sleeve can also include an external retraction feature enabling application of a retraction force by an external device for reducing the diametrical extent.

A bore finishing tool has an arbor with a tapered outer circumferential surface and a sleeve over the arbor having a tapered inner circumferential surface cooperatively disposed in surface to surface overlaying relation to at least a substantial portion of the tapered outer circumferential surface of the arbor. The sleeve is adjustably movable relative to the arbor for expanding a diametrical extent of the sleeve and has a plurality of internal material relief features at circumferentially spaced locations in the tapered inner circumferential surface extending partially through the sleeve so as to reduce a level of force required for expanding the diametrical extent of the sleeve. Exemplary material relief features include flutes and fractures. The sleeve can also include an external retraction feature enabling application of a retraction force by an external device for reducing the diametrical extent.

An apparatus, system, and method using an elastic biasing element in combination with an encoder arrangement for precise control of force or torque applied to a moving object, is applied for controlling a feed force applied to an abrasive element of a bore finishing tool, to respond to changes in the feed force such as can arise from contact with a workpiece bore surface and variations therein, such as tapers, hourglass shapes, barrel shapes, and the like. The elastic biasing element can include a single or multiple springs in one or more sets, and the feed force can be selected to have a constant value or vary as a function of time, position, or other variables or conditions.

An apparatus, system, and method using an elastic biasing element in combination with an encoder arrangement for precise control of force or torque applied to a moving object, is applied for controlling a feed force applied to an abrasive element of a bore finishing tool, to respond to changes in the feed force such as can arise from contact with a workpiece bore surface and variations therein, such as tapers, hourglass shapes, barrel shapes, and the like. The elastic biasing element can include a single or multiple springs in one or more sets, and the feed force can be selected to have a constant value or vary as a function of time, position, or other variables or conditions.

A system for honing a shaft is provided. The system includes a rod having an axis and a head coupleable to the rod. The system also includes a drive motor coupleable to the rod such that the rod and the head are rotatable via the drive motor. The system further includes a linear actuator coupleable to the rod such that the rod and the head are translatable along the axis while being rotated via the drive motor.

The invention relates to an apparatus for honing a bore in a workpiece, having an apparatus base, having a turntable arranged on the apparatus base, with a plurality of workpiece receptacles, having at least one loading station for loading and unloading from the workpiece receptacles, having at least one honing station with a horizontal honing unit and with a displacement device for displacing the horizontal honing unit relative to the turntable, and having at least one tool magazine for receiving a plurality of honing spindles.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.