A robot system comprises a robotic end effector including first, second and third abrasion tools having backing pads in a triangular arrangement.

A device for grinding and deburring a flat workpiece comprise a grinding roller having an abrasive coating. A coaxial drive shaft that is connected rotation-fast to the guide roller is driven by a drive motor via a primary belt drive. The grinding roller is borne axially displaceable on the drive shaft. Via a second secondary belt drive, the drive motor drives a cam mechanism, comprising a control cylinder that is rotatably borne on the drive shaft of the grinding roller and that has a groove cam and comprising a cam slide arranged on the grinding roller. The rotating grinding roller thus performs an oscillating axial back-and-forth movement.

A grinding machine for grinding a surface of an object has at least one grinding tool with a movably mounted abrasive carrier, and a plurality of abrasive elements attached to the abrasive carrier. An abrasive driving device drives the grinding tool in a first relative movement to the object. A conveying device conveys the object with a second relative movement to the grinding tool through the grinding machine. The plurality of abrasive elements each have a plurality of first surfaces provided with first abrasive bodies for lying against the surface of the object in a first direction of movement of the abrasive carrier and a plurality of second surfaces provided with second abrasive bodies for lying against the surface of the object in a second direction of movement of the abrasive carrier opposite to the first direction of movement of the abrasive carrier. The abrasive drive device is adapted to be operated in the first direction of movement in which the first surfaces of the abrasive elements are in grinding engagement with the surface of the object and in the second direction of movement in which the second surfaces of the abrasive elements are in grinding engagement with the surface of the object.

The disclosure relates to a permanent magnet-electromagnet hybrid array type magnetorheological polishing device, comprising a polishing mechanism, a main excitation device arranged on the polishing mechanism, and auxiliary permanent magnet sets used for driving magnetorheological liquid to be recycled. The main excitation device is a permanent magnet-electromagnet hybrid array comprising main excitation permanent magnets and fine-adjustment electromagnetic excitation devices connected with the main excitation permanent magnets. Each fine-adjustment electromagnetic excitation device comprises a coil and a coil retaining pile. The main excitation device further comprises a permanent magnet-electromagnet device connecting plate made from a non-magnetically conductive material. The disclosure can improve magnetorheological polishing efficiency, reduce the size of the excitation device, and balance and control the thickness of a ribbon array, thus realizing high-accuracy and high-quality machining of the surfaces of elements and recycling of magnetorheological liquid.

A support assembly for supporting a surface treatment pad on a backing plate mounted on the spindle of a surface treatment tool includes a plurality of petal-shaped segments, each segment separated from an adjacent segment by a radially extending slit. The support assembly, which may be a unitary body printed from a single material using a 3-D printer may include three layers: a rear layer that rests against the backing plate, a front layer that rests against the surface treatment pad and includes the petal-shaped segments, and a compressible central layer interposed between the rear and front layers. The front layer may also include circumferentially extending grooves and ribs.

A grinding machine, includes a pivotable tool spindle with a workpiece spindle adapted to receive a gearwheel workpiece and for rotationally driving the gearwheel workpiece about a workpiece spindle axis, wherein the tool spindle is configured to receive a grinding tool and rotationally drive the grinding tool about a tool spindle axis, and is carried by a pivot axis in such a way that the tool spindle together with the grinding tool can be pivoted about the pivot axis, and wherein the pivot axis (A) intersects the workpiece spindle axis (C) in a common plane projection, and wherein the pivot axis is offset laterally relative to the workpiece spindle axis and does not intersect the workpiece spindle axis.

The present disclosure relates to a grinding machine. More particularly, the present disclosure relates to a centerless grinding machine comprising a damping device. The present disclosure also relates to a spindle for a grinding machine, and to a damping device for a spindle of a grinding machine, particularly for a grinding spindle or regulator spindle of a centerless grinding machine, wherein the damping device comprises at least one damping unit including an auxiliary mass section, an elastic section and a damping section, which are integrated in the spindle, and which jointly define a damped vibratory system for increasing the dynamic stiffness of the spindle.

A positioning structure for cutting machines or grinder machines has a rotating shaft and a positioning assembly. The rotating shaft has an abutting face, a fixing portion, at least one mounting protrusion, and a fastening hole. The at least one mounting protrusion axially protrudes from the abutting face, and the fixing portion axially protrudes from the at least one mounting protrusion. The fastening hole is axially formed in the at least one mounting protrusion. The positioning assembly is screwed with the rotating shaft and has a positioning element and a fastening element. The positioning element has an abutting portion and a through hole. The fastening element is mounted through the through hole and the fastening hole. Therefore, when a size of an assembling hole of a cutting disk or a grinder disk changes, the rotating shaft does not need to be changed and reinstalled.

The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. The present invention further relates to a polishing apparatus for polishing a substrate with such a polishing head. The polishing head (10) includes a pressing mechanism (12) configured to press a polishing tape (2) against a substrate W, and a tape hook (40) configured to restrict movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape positioning surface (47) that faces a polishing surface of the edge of the polishing tape (2).

A method of manufacturing a window may include cutting a window having a uniform thickness of about 20 m to about 100 m and polishing a cut surface of the window with a polishing pad having an elastic modulus less than an elastic modulus of the window while applying slurry to the cut surface of the window.