An arrangement (50) for grinding edged tools, such as knives, said arrangement (50) configured to be part of a grinding machine (100), comprising a conical grinding wheel (110) arranged to be rotated in a rotational direction (R) and having an envelope grinding surface (111) for an edged tool (10), and a grinding jig (120) for holding an edged tool (10), wherein the grinding jig (120), in use, is arranged such that the edged tool (10) extends over the envelope grinding surface (111) perpendicular to the rotational direction (R).

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

Apparatus and methods for deployment of fixtures. The apparatus may include a system for controlling deployed fixtures. The system may receive user commands different devices in different formats. The fixtures may be independently addressable. The fixtures may be magnetically supported by a fixture support. A brace may join two or more fixture supports without reducing space available to support fixtures. The brace may join a fixture support to a fixture support accessory. An accessory may include a variable-angle junction. The fixture may include articulating joints for controlling the direction of a beam. The fixture may include a lens having an electrically controllable beam spread angle. The fixture may be stowable in the fixture support. The fixture may be slidable along a cord to adjust a height of the fixture. The fixture may include an extendable ring. The system may coordinate motions of the fixtures to follow a target. The fixture may include an elongated board. The elongated board may include a non-polar power socket.

A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

A device for holding in position a product to be processed includes a base connectable by magnetic interaction to a work surface of an apparatus for tumbling or polishing and comprising a first portion and a second portion movable along an operating direction mutually towards or away from a first and a second operating position. The device also includes a retaining support connected to the base and configured to hold in a stable position a product to be processed between a first and a second retaining element. Between the first and the second portion of the base an actuation member is interposed, configured to move the same portions between the first operating position and the second operating position. A method for holding in position a product to be processed is also disclosed.

A polishing assembly and method for polishing optical cables, the polishing assembly having a platform configured to receive a polishing film and configured to rotate according to a dual orbital motion; a force gauge functionally coupled to the platform and configured to measure downward force applied against the platform; a mounting fixture configured to mount a plurality of optical cables; and a movable arm configured to move the mounting fixture downwards to press mounted cables against the polishing film, upwards to pull the mounted cables away from the polishing film, and to rotate circularly along a continuous circular path. The optical cables are pressed against the rotating polishing film while simultaneously monitoring the downward force applied against the platform so that downward force can be maintained within a prescribed tolerance throughout the polishing process.

A polishing assembly and method for polishing optical cables, the polishing assembly having a platform configured to receive a polishing film and configured to rotate according to a dual orbital motion; a force gauge functionally coupled to the platform and configured to measure downward force applied against the platform; a mounting fixture configured to mount a plurality of optical cables; and a movable arm configured to move the mounting fixture downwards to press mounted cables against the polishing film, upwards to pull the mounted cables away from the polishing film, and to rotate circularly along a continuous circular path. The optical cables are pressed against the rotating polishing film while simultaneously monitoring the downward force applied against the platform so that downward force can be maintained within a prescribed tolerance throughout the polishing process.

A wheel conformal burr brushing device includes a lower lifting driving system, a central burr brushing system, a lower gear lifting unit, first burr brushing systems, second burr brushing systems, a synchronous clamping driving system and an upper burr brushing system.

A wheel conformal burr brushing device includes a lower lifting driving system, a central burr brushing system, a lower gear lifting unit, first burr brushing systems, second burr brushing systems, a synchronous clamping driving system and an upper burr brushing system.