A grinding apparatus includes a grinding water supply mechanism that includes a plurality of jet nozzles that jet grinding water to outside surfaces of grindstones, communication passages that make each of the jet nozzles and a water supply source communicate with each other, and valves disposed in the communication passages on a jet nozzle basis, in which opening and closing of the valves are controlled according to the position of the chuck table relative to the grindstones such that the grinding water is jetted only to that region of the grindstones that makes contact with a workpiece.

Provided is a method of transferring a semiconductor wafer to a single-side polishing apparatus without forming scratches on the surface of the semiconductor wafer. The method includes: starting to splay the liquid from each spray hole; placing the semiconductor wafer on the retainer portion to hold a surface of the semiconductor wafer by suction without contact, and raising the tray to attach the semiconductor wafer to the polishing head, wherein a period of time from a point at which the semiconductor wafer is held by the retainer portion to a point at which the attaching of the semiconductor wafer W to the polishing head is completed is 5 s or more, or wherein a ratio of a total area of the protrusions to an area of the semiconductor wafer is 15% or more.

A device for grinding hard metal-tipped teeth of saw bands having a feed device for feeding a temporary workpiece in a timed manner where the temporary workpiece is formed from a plurality of saw bands that are parallel to one another, also having a clamping device that clamps the plurality of saw bands against one another, further having a grinding unit for simultaneously grinding a plurality of teeth, where the grinding unit has a grinding wheel having a plurality of grinding profiles, and a corresponding method.

A grinding apparatus includes a chuck table for holding a workpiece thereon, a table base supporting the chuck table, a grinding unit for grinding the workpiece held on the chuck table with a grinding wheel mounted on an end of a spindle, a load detecting unit for detecting a load applied from the grinding unit to the table base, a tilt adjustment unit supporting the table base thereon, for adjusting a tilt of the table base, a storage for storing a correlative relation between loads applied to the table base and changes in the tilt of the table base, and a controller for controlling the tilt adjustment unit based on the load detected by the load detecting unit and the correlative relation, to adjust the tilt of the table base so that a change in the tilt of the table base that corresponds to the detected load is cancelled out.

A grinding apparatus has a hermetically sealed chamber defined by a portion of a holding surface which extends radially outwardly from a wafer, an outer wall surface of a first annular packing, a lower surface of a plate, and an inner wall surface of a second annular packing. A negative pressure is developed by suction forces applied from the holding surface, allowing the atmospheric pressure to press the plate toward the holding surface and causing the first annular packing to press an outer circumferential portion of the wafer against the holding surface. Since the outer circumferential portion of the wafer is pressed against the holding surface under the suction forces from the holding surface and the atmospheric pressure, the forces pressing the outer circumferential portion of the wafer against the holding surface are increased easily at a low cost without increasing the size and weight of the grinding apparatus.

A processing apparatus includes a chuck table that holds a workpiece, a processing unit that processes the workpiece held by the chuck table, and a panel that surrounds components including the chuck table and the processing unit. Power source sockets are disposed on the panel, and electric apparatuses including an inspection device, a personal computer, a fan, and a cleaner are connected to the power source sockets and are used.

A device for removing wheel burrs with first brushes and second brushes includes a wheel positioning and pressing system configured to position and press of the wheel, a center cap mouth burr removing system configured to remove burrs of the wheel cap mouth with the second brushes, and a wheel spoke back cavity burr removing system configured to remove burrs of the wheel spoke back cavity with the first brushes. The first brushes are mounted on an expandable first capsule and the second brushes are mounted on an expandable second conical capsule, and filling the expandable first capsule and the expandable second conical capsule with air and removing air from the expandable first capsule and the expandable second conical capsule change the shapes of the first brushes and the second brushes to accommodate wheels with different shape and size for deburring.

A device for removing wheel burrs with first brushes and second brushes includes a wheel positioning and pressing system configured to position and press of the wheel, a center cap mouth burr removing system configured to remove burrs of the wheel cap mouth with the second brushes, and a wheel spoke back cavity burr removing system configured to remove burrs of the wheel spoke back cavity with the first brushes. The first brushes are mounted on an expandable first capsule and the second brushes are mounted on an expandable second conical capsule, and filling the expandable first capsule and the expandable second conical capsule with air and removing air from the expandable first capsule and the expandable second conical capsule change the shapes of the first brushes and the second brushes to accommodate wheels with different shape and size for deburring.

The present application relates to an adjustable wheel deburring device, comprising a lower lifting-translating-overturning system, a clamping driving system, a upper lifting-moving system, a adjusting system, a brush unit and a upper deburring system, among others. The device according to the present invention in use is able to not only remove burrs at the back cavity and front of the wheel, but also automatically adjust the shape of the brush belt according to the shape of the wheel back cavity.

The present application relates to an adjustable wheel deburring device, comprising a lower lifting-translating-overturning system, a clamping driving system, a upper lifting-moving system, a adjusting system, a brush unit and a upper deburring system, among others. The device according to the present invention in use is able to not only remove burrs at the back cavity and front of the wheel, but also automatically adjust the shape of the brush belt according to the shape of the wheel back cavity.