There is provided a wafer grinding method of grinding a wafer having an orientation flat for indicating a crystal orientation in the condition where the wafer is held on a holding surface of a chuck table. The chuck table includes a suction holding portion for holding the wafer under suction and a frame portion surrounding the suction holding portion. The suction holding portion has a first cutout portion corresponding to the orientation flat, and the frame portion has a second cutout portion formed along the first cutout portion. The wafer grinding method includes a holding surface grinding step of grinding the holding surface by using abrasive members of a grinding wheel, and a wafer grinding step of grinding the wafer by using the abrasive members in the condition where the wafer is held on the holding surface ground by the abrasive members.

There is provided a wafer grinding method of grinding a wafer having an orientation flat for indicating a crystal orientation in the condition where the wafer is held on a holding surface of a chuck table. The chuck table includes a suction holding portion for holding the wafer under suction and a frame portion surrounding the suction holding portion. The suction holding portion has a first cutout portion corresponding to the orientation flat, and the frame portion has a second cutout portion formed along the first cutout portion. The wafer grinding method includes a holding surface grinding step of grinding the holding surface by using abrasive members of a grinding wheel, and a wafer grinding step of grinding the wafer by using the abrasive members in the condition where the wafer is held on the holding surface ground by the abrasive members.

Provided is a substrate grinding device including: a work table; a first grinding wheel; and a second grinding wheel, wherein the work table is configured to rotate while sucking and holding a substrate, the first grinding wheel and the second grinding wheel are cup wheel type wheels, and provided at positions where the first grinding wheel and the second grinding wheel can be simultaneously in contact with the substrate rotating, the first grinding wheel and the second grinding wheel being configured to grind the substrate rotating, while rotating, and the work table is configured to be able to move a rotation center of the substrate from a first grinding position within a grinding range of the first grinding wheel to a second grinding position within a grinding range of the second grinding wheel.

Provided is a substrate grinding device including: a work table; a first grinding wheel; and a second grinding wheel, wherein the work table is configured to rotate while sucking and holding a substrate, the first grinding wheel and the second grinding wheel are cup wheel type wheels, and provided at positions where the first grinding wheel and the second grinding wheel can be simultaneously in contact with the substrate rotating, the first grinding wheel and the second grinding wheel being configured to grind the substrate rotating, while rotating, and the work table is configured to be able to move a rotation center of the substrate from a first grinding position within a grinding range of the first grinding wheel to a second grinding position within a grinding range of the second grinding wheel.

A polishing fixture and a polishing system are disclosed. The polishing fixture includes a supporting platform, and an operating platform detachably and fixedly connected to the supporting platform. The operating platform includes at least two locating pins, the supporting platform and the operating platform are fixedly connected together to form a placement platform for the product to be polished. The object of the present invention is to provide a polishing fixture and a polishing system, after hundreds of products are fixed by the polishing fixture, the polishing equipment is capable of polishing hundreds of products at one time, which improves the polishing efficiency and reduce the rejection rate of the polishing products at the same time, and the rejection rate is as low as about three per thousand.

A polishing fixture and a polishing system are disclosed. The polishing fixture includes a supporting platform, and an operating platform detachably and fixedly connected to the supporting platform. The operating platform includes at least two locating pins, the supporting platform and the operating platform are fixedly connected together to form a placement platform for the product to be polished. The object of the present invention is to provide a polishing fixture and a polishing system, after hundreds of products are fixed by the polishing fixture, the polishing equipment is capable of polishing hundreds of products at one time, which improves the polishing efficiency and reduce the rejection rate of the polishing products at the same time, and the rejection rate is as low as about three per thousand.

In a polishing apparatus an optical connector polishing jig holds the MT ferrule provided at the connection end portion of the optical connector, the optical connector polishing jig includes: a cylinder base; a cylinder shaft held on the cylinder base to be capable of moving in the up-down direction; and a set block connected to an end of the cylinder shaft and having a hole into which the MT ferrule is inserted and in which fixing means for adjusting the pressing force and fixing the MT ferrule is inserted, and a surface of the fixing means that comes into contact with the MT ferrule has a protrusion that partially protrudes to apply a pressing force to the MT ferrule such that when the MT ferrule is fixed, an end surface of the MT ferrule is slightly deformed and a center portion of the end surface in a longitudinal direction swells.

In a polishing apparatus an optical connector polishing jig holds the MT ferrule provided at the connection end portion of the optical connector, the optical connector polishing jig includes: a cylinder base; a cylinder shaft held on the cylinder base to be capable of moving in the up-down direction; and a set block connected to an end of the cylinder shaft and having a hole into which the MT ferrule is inserted and in which fixing means for adjusting the pressing force and fixing the MT ferrule is inserted, and a surface of the fixing means that comes into contact with the MT ferrule has a protrusion that partially protrudes to apply a pressing force to the MT ferrule such that when the MT ferrule is fixed, an end surface of the MT ferrule is slightly deformed and a center portion of the end surface in a longitudinal direction swells.

A clamping assembly includes first and second jaws supported above a base in opposed, spaced-apart alignment on opposite sides of a central clamp axis, each jaw having a proximal end portion adjacent the base and an opposite distal end portion, where the jaws are pivotable between an open position and a closed position. A wedge movable along the central clamp axis between the proximal end portions of the pair of jaws in response to moving a handle between a first handle position and a second handle position. A cam assembly between the wedge and the base includes a cam, a follower on the proximal handle end portion, and a spring between the cam and the base. Compressing the spring increases an axial distance between the cam and the wedge.

A clamping assembly includes first and second jaws supported above a base in opposed, spaced-apart alignment on opposite sides of a central clamp axis, each jaw having a proximal end portion adjacent the base and an opposite distal end portion, where the jaws are pivotable between an open position and a closed position. A wedge movable along the central clamp axis between the proximal end portions of the pair of jaws in response to moving a handle between a first handle position and a second handle position. A cam assembly between the wedge and the base includes a cam, a follower on the proximal handle end portion, and a spring between the cam and the base. Compressing the spring increases an axial distance between the cam and the wedge.