A honing machine (100) for honing a bore in a workpiece comprises a support structure (120) fixed to the machine and at least one honing unit (130) which is mounted on the support structure and which has a main support (160), which can be mounted fixedly in relation to the support structure, and a spindle unit (150), which is supported by the main support and in which a spindle shaft (152) is rotatably mounted, wherein the spindle shaft (152) is rotatable about a spindle axis (155) by means of a rotary drive and, at a tool-side end (153), has a device for the fastening of a honing tool. The honing machine furthermore has a linear guide system which is arranged between the main support (160) and the spindle unit (150) and which serves for guiding a linear stroke movement of the spindle unit (150) relative to the main support (160), a stroke drive for generating the stroke movement of the spindle unit (150), and an alignment system (200) for setting the alignment of the spindle axis (155) in relation to the support structure (120). The alignment system (200) is designed for the continuously variable, reversible setting of the alignment of the spindle axis (155) in relation to the support structure (120), wherein the alignment system is designed for the independent setting of the position of the spindle axis (155) along two mutually perpendicular axes of translation and for the setting of the orientation of the spindle axis (155) in relation to two mutually perpendicular axes of rotation.

A grinding machine includes a plane grinding mechanism carrying a workpiece, an electrically controlled device mounted on the plane grinding mechanism, a grinder unit rotatably mounted on the plane grinding mechanism to grind the workpiece, and a smart working control system mounted on the plane grinding mechanism and electrically coupled to the electrically controlled device. The smart working control system includes a smart coder and a smart driver. When a load and a cutting force produced between the grinder unit and the workpiece reach preset parameters during the grinding process, the smart driver executes the working sequence or parameter setting program edited by the smart coder, to shorten a movement distance of the workbench of the plane grinding mechanism along the X-axis (leftward and rightward), and to produce an optimum lapping path.

A burnishing tool uses a relatively small pressing load in burnishing. The burnishing tool for machining a target surface of a workpiece includes a base and a tip portion located on a distal end of the base. The tip portion includes a linear slide-contact portion that linearly contacts and slides on the target surface.

A burnishing tool uses a relatively small pressing load in burnishing. The burnishing tool for machining a target surface of a workpiece includes a base and a tip portion located on a distal end of the base. The tip portion includes a linear slide-contact portion that linearly contacts and slides on the target surface.

The present invention relates to a smart BGA chip maintenance device comprising a base, a moving worktable, a horizontal slide, a vertical slide, a grinding knife, an electronic microscope and a mini-sized air compressor, wherein the base comprises a platform and a portal frame. The moving worktable is propelled by a first driving mechanism, wherein the horizontal slide is propelled by a second driving mechanism, wherein the vertical slide is propelled by a third driving mechanism. Both a grinding knife and an electronic microscope are provided on the vertical slide. An air pipe is disposed at the side of the grinding knife, wherein the grinding knife is propelled by a fourth driving mechanism to rotate, wherein the device can automatically perceive the flatness of the chip, ensuring a horizontal grinding process and avoiding the damage to the soldering pad of the circuit board.

The present invention relates to a smart BGA chip maintenance device comprising a base, a moving worktable, a horizontal slide, a vertical slide, a grinding knife, an electronic microscope and a mini-sized air compressor, wherein the base comprises a platform and a portal frame. The moving worktable is propelled by a first driving mechanism, wherein the horizontal slide is propelled by a second driving mechanism, wherein the vertical slide is propelled by a third driving mechanism. Both a grinding knife and an electronic microscope are provided on the vertical slide. An air pipe is disposed at the side of the grinding knife, wherein the grinding knife is propelled by a fourth driving mechanism to rotate, wherein the device can automatically perceive the flatness of the chip, ensuring a horizontal grinding process and avoiding the damage to the soldering pad of the circuit board.

A system of polishing a concave surface of an external piece for a timepiece, including a securing device including a support that carries the piece, and a grinding device including an abrasive mechanism rotatably mounted along a first axis and configured to polish the piece along a first curvature. The securing device further includes a moving mechanism of the support so that the support imparts a back-and-forth motion along a second axis and a contact surface of the abrasive mechanism is curved to polish the piece along a second curvature in addition to the first curvature. The system can be applied to the field of crystals for a timepiece.

A system of polishing a concave surface of an external piece for a timepiece, including a securing device including a support that carries the piece, and a grinding device including an abrasive mechanism rotatably mounted along a first axis and configured to polish the piece along a first curvature. The securing device further includes a moving mechanism of the support so that the support imparts a back-and-forth motion along a second axis and a contact surface of the abrasive mechanism is curved to polish the piece along a second curvature in addition to the first curvature. The system can be applied to the field of crystals for a timepiece.

Device and method for the finishing machining of an internal face of a workpiece, such as the track of a ball screw, including a workpiece holder and a finishing tool held on a finishing tool holder. A rotary drive is provided, by which the workpiece holder and the finishing tool is rotationally driven relative to one another about a rotational axis. A linear drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in a translatory manner relative to one another along the rotational axis. An oscillating drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in an oscillating manner relative to one another in the direction parallel to the rotational axis and wherein the finishing tool is pivotably held on the finishing tool holder about a pivot axis.

The present disclosure is directed towards polishing modules for performing chemical mechanical polishing of a substrate. The substrate may be a semiconductor substrate. The polishing modules described have a plurality of pads, such as polishing pads, disposed within a single polishing station. The pads are configured to remain stationary during processing, such as during polishing or buff operations. Either an x-y gantry assembly or a head actuation assembly is coupled to a system body of a polishing module and is configured to move a carrier head over the pads. Between process operations the polishing pads may be indexed to expose a new polishing pad to the carrier head.