Apparatus for positioning and fixing molded blanks of eyeglass frames to a multi-axis machine tool, for finishing operations such as, for example, milling and boring. The apparatus comprises a base plate to be fixed to the worktable of the machine tool and a pair of adjacent cylinders vertically extending from the base plate to which they are fixed at their lower ends, with the interposition of a hydraulic or pneumatic seal. The vertical axes of the pair of adjacent cylinders are horizontally spaced apart from each other by a length that substantially corresponds to the center-to-center distance between the lens receptacles formed in the eyeglass frame blank to be finished. Each cylinder is provided with a respective piston element therein, whose upper end is connected to a cylindrical core whose upper end portion, distal to the base plate, has a frustoconical shape. Said piston element is vertically movable in their respective cylinder, under pneumatic control, thus causing the raising and lowering of the cylindrical core connected thereto. At the upper end, distal to the base plate, of the wall of each cylinder of the pair of cylinders, a radial slide group is housed, each having a respective block of plastic material whose profile can be machined into such a shape as to be able to fit into and engage with the inner profile of the respective lens receptacle, to hold it in position during the processing operations. The radial slides and therefore the respective blocks are imparted a rectilinear radial motion to and from the central axis of the cylinder, obtained by a sliding coupling between the end of each slide, facing the axis of the cylinder, and opposed axial guides radially projecting from the frustoconical section of the cylindrical core connected to said piston element.

The invention pertains in general to a latching mechanism for maintaining desired friction levels on an optical disc in an optical disc restoration device. In particular the invention pertains to devices, systems and methods for easily maintaining friction levels between pads and an optical disc in an optical disc restoration device for ease of adjusting friction settings during quality control, repair operation or when optimization settings are being set in an optical disc restoration device by a user.

The invention pertains in general to a latching mechanism for maintaining desired friction levels on an optical disc in an optical disc restoration device. In particular the invention pertains to devices, systems and methods for easily maintaining friction levels between pads and an optical disc in an optical disc restoration device for ease of adjusting friction settings during quality control, repair operation or when optimization settings are being set in an optical disc restoration device by a user.

A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.

A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.

Disclosed is a method implemented by a computer, for determining the position of an optical lens member having a surface placed on a lens blocking ring, the blocking ring including a bearing zone arranged to bear at least partially a placed known surface of the optical lens member when the known surface of the optical lens member is placed on the lens blocking ring and hold by a force applied on the optical lens member, the method includes finding a trio of points of the bearing zone that forms a triangle including the projection on the main plane of the point of application of the force; and a position of the optical lens having a virtual contact between the placed known surface and the ring at the location of the trios of points.

Disclosed is a method implemented by a computer, for determining the position of an optical lens member having a surface placed on a lens blocking ring, the blocking ring including a bearing zone arranged to bear at least partially a placed known surface of the optical lens member when the known surface of the optical lens member is placed on the lens blocking ring and hold by a force applied on the optical lens member, the method includes finding a trio of points of the bearing zone that forms a triangle including the projection on the main plane of the point of application of the force; and a position of the optical lens having a virtual contact between the placed known surface and the ring at the location of the trios of points.

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.