The present disclosure describes a method and apparatus to remove consumable (e.g., sacrificial) polishing pad layers from a multilayer polishing pad. For example, the method includes measuring a thickness profile of a top polishing pad layer of a multilayer polishing pad and comparing the thickness profile to a threshold. The method, in response to the thickness profile being above the threshold, rinses the top polishing pad layer of the multilayer polishing pad and removes, after the top polishing pad layer has been rinsed, the top polishing pad layer to expose an underlying polishing pad layer of the multilayer polishing pad.

A semiconductor manufacturing apparatus includes a sound measuring unit that measures a first polishing sound of a film formed on a wafer, a sound pressure prediction regression model generation unit that generates a first regression model for obtaining a first sound pressure prediction value of the first polishing sound, a sound pressure prediction value calculation unit that performs a first calculation of the first sound pressure prediction value by using the first regression model, a residual difference calculation unit that performs a second calculation of a first residual difference, the first residual difference being a difference between a first sound pressure actual measurement value of the first polishing sound and the first sound pressure prediction value, and an end point determination unit that determines a polishing end point of the film by using the first residual difference.

A process for support material removal for 3D printed parts wherein the part is placed in a media filled tank and support removal is optimized in a multi-parameter system through an artificial intelligence process which may include, but is not limited to, the use of historical data, parametric testing data, normal support removal data, and outputs from other support removal AI models to generate optimally efficient use of each parameter in terms of pulse repetition interval (PRI) and cycle time as defined by pulse width (PW). The input parameters may include heat, circulation, ultrasound and chemical reaction, which are used in sequence and/or in parallel, to optimize efficiency of support removal. Sequentially and/or in parallel, heat, pump circulation and ultrasound may vary in application or intensity. Selection of means of agitation depends on monitored feedback from the support removal tank and application of a statistically dynamic rule based system (SDRBS).

An automatic grinding machine with positioning effect has a body, at least two positioning sets, and a processing set. The body has a base, a grinding mount, a drive device, and a fixture. The base has a chamber. The at least two positioning sets are connected to the body and each positioning set has a displacement device and an optical module. The displacement device is mounted in the chamber. The optical module is disposed on the displacement device and is moved relative to the grinding mount by the drive device to position locations of the grinding mount and a probe card. The processing set is electrically connected to the drive device and the fixture of the body and the displacement device and the optical module of each positioning set, and has a computer control interface.

A polishing tool wear amount prediction device, machine learning device, and system capable of predicting a wear amount of a polishing tool unit of a polishing tool during polishing are provided. The polishing tool wear amount prediction device includes a machine learning device which observes polishing condition data indicating a processing condition of polishing as a state variable indicating a current environment state and performs, based on the state variable, learning or prediction by using a learning model which stores a correlation of the wear amount of the polishing tool with respect to the processing condition of polishing.

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.

The present disclosure describes an apparatus and a method to detect a polishing pad profile during a polish process and adjust the polishing process based on the detected profile. The apparatus can include a polishing pad configured to polishing a substrate, a substrate carrier configured to hold the substrate against the polishing pad, and a detection module configured to detect a profile of the polishing pad. The detection module can include a probe configured to measure a thickness of one or more areas on the polishing pad, and a beam configured to support the probe, where the probe can be further configured to move along the beam.

Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing an CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) with a time-alternating force and/or means for measuring an electrical characteristic of the CMP-process. The time-alternating force is applied with the use of a system component that is electrically isolated from the workpiece and that is disposed in the carrier-chick in which the workpiece is affixed for CMP-process, while the electrical characteristic is measured with the use of a judiciously-configured reservoir in which the used fluid is collected. The use of such CMP-apparatus.

Disclosed is a device for removing burrs from an aluminum alloy hub. The device includes a workbench, columns, a brush, a spindle, a spindle box, a cross beam, a spindle motor, a controller, a parallel robot, and a displacement sensor. Columns are fixedly connected to the workbench, and the cross beam is connected to the columns and a position of the cross beam can be adjusted along the columns; the spindle box is connected to the cross beam, and moves horizontally on the cross beam; the spindle, the spindle motor and the controller are mounted on the spindle box, and the brush is mounted at the end of the spindle; the brush is driven to rotate by the spindle motor and controlled by the controller; and the displacement sensor is mounted in the brush. The parallel robot can implement precise adjustment, and can perform real-time posture adjustment according to the instruction of the controller to ensure that the brush is always in close contact with the back cavity of the hub.

A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.