Stored is a height of a grinding mechanism when lower surfaces of grinding stones have come into contact with an upper surface of a wafer held on a holding surface, through lowering of the grinding mechanism from above the wafer. Based on this height, an origin point height which is a height of the grinding mechanism when the lower surfaces of the grinding stones have come into contact with the holding surface is then determined.

A workpiece centering gauge for a grinding machine includes a link having a first pivot configured to couple with the grinding machine; a first encoder that measures an angle of the link at the first pivot; a second pivot included with the link; a measuring fork configured to releasably contact an outer surface of an elongated workpiece; a surface feeler, having a transducer, included with the measuring fork that measures a workpiece diameter a second encoder that measures an angular position of the link relative to the measuring fork; the angular position measured by the first encoder, the angular position measured by the second encoder, and a measured workpiece diameter are used to determine a deviation of the elongated workpiece from a centerline.

A workpiece centering gauge for a grinding machine includes a link having a first pivot configured to couple with the grinding machine; a first encoder that measures an angle of the link at the first pivot; a second pivot included with the link; a measuring fork configured to releasably contact an outer surface of an elongated workpiece; a surface feeler, having a transducer, included with the measuring fork that measures a workpiece diameter a second encoder that measures an angular position of the link relative to the measuring fork; the angular position measured by the first encoder, the angular position measured by the second encoder, and a measured workpiece diameter are used to determine a deviation of the elongated workpiece from a centerline.

A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the substrate supported by the table in a center direction of the table to position the substrate. The at least three centering mechanisms each include a rotation shaft arranged in a peripheral area of the table and a centering member mounted to the rotation shaft.

A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the substrate supported by the table in a center direction of the table to position the substrate. The at least three centering mechanisms each include a rotation shaft arranged in a peripheral area of the table and a centering member mounted to the rotation shaft.

A processing method of processing a substrate in a processing apparatus includes performing a first grinding processing on the substrate in a first grinder; performing a second grinding processing on the substrate in a second grinder; performing a first re-grinding processing on the substrate in the first grinder; and performing a second re-grinding processing on the substrate in the second grinder. The substrate is ground to a final thickness in the second re-grinding processing.

A grinding machine and a method for grinding large crankshafts are disclosed. During pre-grinding, steady-rest seats are ground, and a plurality of steady rests are placed against them. Synchronous electric drives drive the crankshaft at both ends. A desired shape is produced by interpolating motion of a first grinding disk about CNC-controlled X and Z axes and about a WK pivot axis. The grinding disk is a CBN grinding disk with a width less than the axial length of the main journals and crankpins of the crankshaft. Diameters are measured along the axial length of the main journals and/or crankpins by an in-process device. The drives for the X1, Z1, and WK axes are controlled in an interpolating manner on the basis of the measurements to achieve the desired shape.

A grinding machine and a method for grinding large crankshafts are disclosed. During pre-grinding, steady-rest seats are ground, and a plurality of steady rests are placed against them. Synchronous electric drives drive the crankshaft at both ends. A desired shape is produced by interpolating motion of a first grinding disk about CNC-controlled X and Z axes and about a WK pivot axis. The grinding disk is a CBN grinding disk with a width less than the axial length of the main journals and crankpins of the crankshaft. Diameters are measured along the axial length of the main journals and/or crankpins by an in-process device. The drives for the X1, Z1, and WK axes are controlled in an interpolating manner on the basis of the measurements to achieve the desired shape.

A polishing apparatus and a polishing method capable of accurately measuring a film thickness of a workpiece, such as wafer, substrate, or panel, used in manufacturing of semiconductor devices during polishing of the workpiece are disclosed. The processing system is configured to determine a film thickness of the workpiece based on relative reflectance data calculated by a calculation formula expressed as: the relative reflectance data=MD1/[BD1.Math.k], where MD1 represents first intensity measurement data indicating intensity of the reflected light from the workpiece measured by the first spectrometer, BD1 represents the first base intensity data, and k represents a rate of change in second intensity measurement data with respect to the second base intensity data. The second intensity measurement data is indicative of intensity of the light of the light source measured by the second spectrometer during polishing of the workpiece.

A method implemented by computer for processing an unfinished optical lens member for manufacturing an optical lens, the unfinished optical lens member having an unfinished surface and an aspherical finished surface having a first reference system with a first reference point, and the optical lens to be manufactured including first and second surfaces, the first surface including a second reference system with a second reference point and included in the aspherical finished surface of the lens member, the method including: providing an unfinished optical lens member data; providing an optical function; providing a reference point position; providing an optical lens parameter; determining a reference system; determining a first surface dataset; and determining a second surface dataset.