The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported and which is supported on the frame (160) in such a way that the roller carrier can be moved in a first direction (x). The device (100) comprises at least a second roller (103), which is supported on the frame (160), and a belt (102), which is guided at least around the two rollers (101, 103) and because of the tension of which a resulting belt force (102) acts on the roller carrier (401). The device (100) also comprises an actuator (302), which is mechanically coupled to the frame (160) and the roller carrier (401) in such a way that an adjustable actuator force (FA) acts between the frame (160) and the first roller (101) in the first direction (x). The belt (102) is guided by means of the second roller (103), or by means of the second roller (103) and further rollers (101a, 101b, 121a, 121b, 105), in such a way that the resulting belt force (FB, FB′) acting on the roller carrier (401) acts approximately in a second direction (y) orthogonal to the first direction (x) in the case of a target deflection of the actuator (302).

A method, which can accurately determine in a short time a relationship between a load of a dresser and a pressure of a gas supplied to an air cylinder, is disclosed. The method includes determining a first contact point where a load measurement device is brought into contact with a polishing table, calculating a relational expression composed to a quadratic function showing a relationship between a measured load and a measured pressure, determining a second contact point where the dresser is brought into contact with a polishing surface of a polishing pad, calculating an amount of correction from the pressure of the gas at the first contact point and the pressure of the gas at the second contact point, and correcting the relational expression based on the calculated amount of correction.

A method, which can accurately determine in a short time a relationship between a load of a dresser and a pressure of a gas supplied to an air cylinder, is disclosed. The method includes determining a first contact point where a load measurement device is brought into contact with a polishing table, calculating a relational expression composed to a quadratic function showing a relationship between a measured load and a measured pressure, determining a second contact point where the dresser is brought into contact with a polishing surface of a polishing pad, calculating an amount of correction from the pressure of the gas at the first contact point and the pressure of the gas at the second contact point, and correcting the relational expression based on the calculated amount of correction.

A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.

A hand-held power tool includes a gearing housing part and accessory equipment. The gearing housing part has at least one machine-side contact element. The accessory equipment has at least one accessory-equipment-side contact element. The machine-side contact element and the accessory-equipment-side contact element can be releasably connected to each other.

A hand-held power tool includes a gearing housing part and accessory equipment. The gearing housing part has at least one machine-side contact element. The accessory equipment has at least one accessory-equipment-side contact element. The machine-side contact element and the accessory-equipment-side contact element can be releasably connected to each other.

A planarization process can be performed on a moving structure by moving a planarizing pad against the moving structure. A liquid and a gas can be injected into a flow cell integrated in the moving pad to produce a two-phase liquid-gas flow in the flow cell while a surface of the moving structure contacts the two-phase liquid-gas flow. An endpoint of the planarization process can be determined by determining that a characteristic of the two-phase liquid-gas flow changes to a predetermined characteristic.

A planarization process can be performed on a moving structure by moving a planarizing pad against the moving structure. A liquid and a gas can be injected into a flow cell integrated in the moving pad to produce a two-phase liquid-gas flow in the flow cell while a surface of the moving structure contacts the two-phase liquid-gas flow. An endpoint of the planarization process can be determined by determining that a characteristic of the two-phase liquid-gas flow changes to a predetermined characteristic.