A leak checking method which is capable of detecting a leak of compressed gas supplied to a polishing head without removing the polishing head from a polishing apparatus is disclosed. The leak checking method includes: supplying a compressed gas into a pressure chamber, which is formed by a membrane of a polishing head, with the membrane placed in contact with a stationary surface; measuring a flow rate of the compressed gas during supplying of the compressed gas into the pressure chamber, while regulating a pressure of the compressed gas by use of a pressure regulator; deciding whether or not the flow rate measured when a variation in the pressure of the compressed gas is within an allowable range of variation, is within a reference range; and generating a leak-detection signal when the flow rate is outside of the reference range.

A leak checking method which is capable of detecting a leak of compressed gas supplied to a polishing head without removing the polishing head from a polishing apparatus is disclosed. The leak checking method includes: supplying a compressed gas into a pressure chamber, which is formed by a membrane of a polishing head, with the membrane placed in contact with a stationary surface; measuring a flow rate of the compressed gas during supplying of the compressed gas into the pressure chamber, while regulating a pressure of the compressed gas by use of a pressure regulator; deciding whether or not the flow rate measured when a variation in the pressure of the compressed gas is within an allowable range of variation, is within a reference range; and generating a leak-detection signal when the flow rate is outside of the reference range.

A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.

A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.

An attachment for a mobile handling device is configured for processing walls or ceilings. The attachment comprises a mounting unit that is arranged to be supported at a mounting interface of the handling device, a processing head that is arranged to be equipped with at least one tool for material-removing processing or smoothing processing, and a compensation arrangement that is arranged between the mounting unit and the processing head and that defines a longitudinal axis. The mounting unit provides at least two pivot positions for the attachment that are offset from one another. The processing head is movable relative to the mounting unit in a longitudinal direction along the longitudinal axis. The compensation arrangement is configured to provide a defined contact pressure force for the processing head in a defined operating range along the longitudinal axis towards the surface to be processed.

Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.

Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.

In the case of a honing method for machining the internal face (214) of a bore (210) in a workpiece (200) with the aid of at least one honing operation, during a honing operation a flaring-capable honing tool (150) that is coupled to a spindle is moved back and forth within the bore for generating a reciprocating movement in the axial direction of the bore, and are simultaneously rotated for generating a rotating movement that superimposes the reciprocating movement. A bore shape having an axial contour profile which is rotationally symmetrical in terms of a bore axis (212) and deviates from the circular cylindrical shape is generated herein. For generating an axially variable material removal in at least one stroke modification phase a stroke length and/or a stroke orientation of the reciprocating movement is modified. A honing tool (150) which has an annular cutting group (155) having a plurality of radially actuatable cutting material members (156) that are distributed about the circumference of the tool body (152) is used herein. The honing method is distinguished in that during the stroke modification phase a measurement of the actual diameter of the bore (210) is carried out for determining a diameter measurement signal which represents the actual diameter of the bore in a measurement plane, and the stroke length and/or the stroke orientation of the reciprocating movement is controlled as a function of the diameter measurement signal. Also described is a machine tool that is suitable for carrying out the honing method. The honing method is particularly suitable for honing cylinder running faces in the production of cylinder blocks or cylinder liners for reciprocating piston engines.

A burnishing tool and a method of additively manufacturing components of the burnishing tool are provided. The burnishing tool includes a burnishing element for burnishing a workpiece. The burnishing element is positioned between an upper nozzle and a lower nozzle which are additively manufactured to define a plurality of internal fluid passageways for receiving, distributing, and discharging a burnishing fluid to facilitate cooling and/or lubrication of the burnishing element and/or the workpiece.

A burnishing tool and a method of additively manufacturing components of the burnishing tool are provided. The burnishing tool includes a burnishing element for burnishing a workpiece. The burnishing element is positioned between an upper nozzle and a lower nozzle which are additively manufactured to define a plurality of internal fluid passageways for receiving, distributing, and discharging a burnishing fluid to facilitate cooling and/or lubrication of the burnishing element and/or the workpiece.