A tool sharpener has first and second guide surfaces to respectively support a cutting tool adjacent first and second abrasive surfaces. A drive assembly moves the first and second abrasive surfaces with respect to the first and second guide surfaces. A control circuit directs a user to place the cutting tool against the first abrasive surface using the first guide surface to sharpen a cutting edge of the tool during a first sharpening operation. The control circuit activates an indicator mechanism at a conclusion of the first sharpening operation to direct the user to perform a second sharpening operation in which the user presents the cutting tool against the second abrasive surface using the second guide surface to sharpen the cutting edge.

A tool sharpener has first and second guide surfaces to respectively support a cutting tool adjacent first and second abrasive surfaces. A drive assembly moves the first and second abrasive surfaces with respect to the first and second guide surfaces. A control circuit directs a user to place the cutting tool against the first abrasive surface using the first guide surface to sharpen a cutting edge of the tool during a first sharpening operation. The control circuit activates an indicator mechanism at a conclusion of the first sharpening operation to direct the user to perform a second sharpening operation in which the user presents the cutting tool against the second abrasive surface using the second guide surface to sharpen the cutting edge.

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

There is provided a polishing amount estimation device which can facilitate the setting of parameters of teaching trajectory or force control in a polishing operation. A polishing amount estimation device for estimating a polishing amount in a polishing operation which is performed by bringing a polishing tool mounted on a robot manipulator into contact with a target workpiece by force control includes a memory which stores a motion program, and a polishing amount estimation part configured to estimate the polishing amount based on at least one of a motion trajectory of the polishing tool, a movement speed of the polishing tool, and a pressing force of the polishing tool against the target workpiece, which are obtained based on the motion program.

There is provided a polishing amount estimation device which can facilitate the setting of parameters of teaching trajectory or force control in a polishing operation. A polishing amount estimation device for estimating a polishing amount in a polishing operation which is performed by bringing a polishing tool mounted on a robot manipulator into contact with a target workpiece by force control includes a memory which stores a motion program, and a polishing amount estimation part configured to estimate the polishing amount based on at least one of a motion trajectory of the polishing tool, a movement speed of the polishing tool, and a pressing force of the polishing tool against the target workpiece, which are obtained based on the motion program.

Provided is a substrate processing apparatus. The substrate processing apparatus comprises a polishing table; a polishing pad disposed on an upper surface of the polishing table; a conditioner including a conditioner head, a disk holder movably coupled to the conditioner head in a vertical direction, and a conditioning disk mounted to the disk holder and in contact with the polishing pad; and a thickness measuring unit of obtaining the thickness of the polishing pad from the relative moving distance of the disk holder with respect to the conditioner head, wherein the information of the relative moving distance is received from sensing unit.

Provided is an electrically powered tool having an improved sensor substrate mounting structure, the electrically powered tool being configured so that a brushless type motor is axially contained in a cylindrical housing. The electrically powered tool has: a cylindrical housing for axially containing a motor; a control unit for controlling the motor; and a sensor substrate having mounted thereon a plurality of position detecting elements for detecting the rotational position of a rotor. The sensor substrate is gripped between the insulator of the motor and the housing and held on the housing side when axially mounting the motor. The sensor substrate is annularly shaped and has formed at the center thereof a through-hole through which a bearing for the motor is passed. The portion of the sensor substrate, on which a Hall IC is mounted, is provided with a synthetic resin cover member for protecting the Hall IC against dust.

Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data from the in-situ monitoring system. For each scan, a portion of the measured signal values are adjusted based on the thickness of the polishing pad. For each scan of the plurality of scans and each location of the plurality of different locations, a value is generated representing a thickness of the layer at the location. This includes processing the adjusted signal values using one or more processors configured by machine learning. A polishing endpoint is detected or a polishing parameter is modified based on the values representing the thicknesses at the plurality of different locations.

An electric power tool. The electric power tool may include: a motor; a control device configured to control the motor; a power transmission mechanism connected to the motor; a housing that houses the motor, the control device and the power transmission mechanism; an end tool holder connected to the power transmission mechanism; an accessory configured to be detachably attached to the housing; and a detector configured to detect whether the accessory is attached or not. The detector may include: a link member configured to move with respect to the housing according to the accessory being attached or detached; a magnet fixed in position with respect to one of the link member and the housing; and a magnetic sensor fixed in position with respect to another of the link member and the housing.

An electric power tool. The electric power tool may include: a motor; a control device configured to control the motor; a power transmission mechanism connected to the motor; a housing that houses the motor, the control device and the power transmission mechanism; an end tool holder connected to the power transmission mechanism; an accessory configured to be detachably attached to the housing; and a detector configured to detect whether the accessory is attached or not. The detector may include: a link member configured to move with respect to the housing according to the accessory being attached or detached; a magnet fixed in position with respect to one of the link member and the housing; and a magnetic sensor fixed in position with respect to another of the link member and the housing.