A calibration device (500, 1000) for calibrating a floor surfacing system (200), the calibration device comprising at least four infrared sources (510, 520, 530, 540) arranged separated from each other on a structural member (501) according to a known geometrical configuration, where three of the infrared sources (510, 530, 540) are located in a common plane and where a fourth infrared source (520) is located distanced from the common plane along a normal vector to the common plane, wherein the calibration device (500, 1000) is arranged to be positioned at one or more locations around a perimeter of the surface to be processed in view from an nfrared vision sensor (210), whereby the infrared vision sensor may obtain images of the calibration device at the one or more locations.

There is provided a polishing amount estimation device which can facilitate the setting of parameters of teaching trajectory or force control in a polishing operation. A polishing amount estimation device for estimating a polishing amount in a polishing operation which is performed by bringing a polishing tool mounted on a robot manipulator into contact with a target workpiece by force control includes a memory which stores a motion program, and a polishing amount estimation part configured to estimate the polishing amount based on at least one of a motion trajectory of the polishing tool, a movement speed of the polishing tool, and a pressing force of the polishing tool against the target workpiece, which are obtained based on the motion program.

There is provided a polishing amount estimation device which can facilitate the setting of parameters of teaching trajectory or force control in a polishing operation. A polishing amount estimation device for estimating a polishing amount in a polishing operation which is performed by bringing a polishing tool mounted on a robot manipulator into contact with a target workpiece by force control includes a memory which stores a motion program, and a polishing amount estimation part configured to estimate the polishing amount based on at least one of a motion trajectory of the polishing tool, a movement speed of the polishing tool, and a pressing force of the polishing tool against the target workpiece, which are obtained based on the motion program.

A determining tool for use in determining the shape of the tip end of a machining tool that machines a workpiece held on a table while the machining tool moves relatively to the table includes a bottom surface adapted to be held on the table and a flat slanting surface inclined to the bottom surface and oriented across a direction in which the machining tool moves relatively to the table, the flat slanting surface being adapted to be cut through by the tip end of the machining tool.

A polishing method capable of accurately measuring a film thickness of a substrate, such as a wafer, by enhancing light intensity of a flash-light source, such as a xenon flash lamp is disclosed. The polishing method includes: while an optical sensor head is moving across a substrate, causing a flash-light source to emit light plural times in a first exposure time of a light detector to direct the light to the substrate via the optical sensor head, capturing reflected light from the substrate by the light detector via the optical sensor head, further causing the flash-light source to emit light plural times in a second exposure time of the light detector to direct the light to the substrate via the optical sensor head, and capturing reflected light from the substrate by the light detector via the optical sensor head; generating a spectrum of the reflected light; and detecting a surface state of the substrate from the spectrum.

A polishing method capable of accurately measuring a film thickness of a substrate, such as a wafer, by enhancing light intensity of a flash-light source, such as a xenon flash lamp is disclosed. The polishing method includes: while an optical sensor head is moving across a substrate, causing a flash-light source to emit light plural times in a first exposure time of a light detector to direct the light to the substrate via the optical sensor head, capturing reflected light from the substrate by the light detector via the optical sensor head, further causing the flash-light source to emit light plural times in a second exposure time of the light detector to direct the light to the substrate via the optical sensor head, and capturing reflected light from the substrate by the light detector via the optical sensor head; generating a spectrum of the reflected light; and detecting a surface state of the substrate from the spectrum.

A tool device (1) for machining a workpiece (4) by cutting, milling, drilling or grinding, comprising a sensor (20) for detecting a condition of the tool device (1) during machining, wherein the sensor (20) is connectable to a receiving unit (40), which transmits data to an analysis unit (50) for analyzing the received data. The sensor (20) is configured as a fiber optic sensor (20) comprising at least one optical fiber (26) providing an incident optical path (22) and a reflected optical path (24) for a light beam emitted by a connectable light source (30) and with a distal end thereof lying in a surface (14, 74) of the tool device (1) such that the optical path length can be measured.

A tool device (1) for machining a workpiece (4) by cutting, milling, drilling or grinding, comprising a sensor (20) for detecting a condition of the tool device (1) during machining, wherein the sensor (20) is connectable to a receiving unit (40), which transmits data to an analysis unit (50) for analyzing the received data. The sensor (20) is configured as a fiber optic sensor (20) comprising at least one optical fiber (26) providing an incident optical path (22) and a reflected optical path (24) for a light beam emitted by a connectable light source (30) and with a distal end thereof lying in a surface (14, 74) of the tool device (1) such that the optical path length can be measured.

The present invention provides a measurement device for grinding wheel. One or more thickness measurement device is disposed slidably on a platform. A spinning device is disposed on the platform. A grinding wheel is fixed on the spinning device. The spinning shaft spins the grinding wheel. The one or more thickness measurement device measures the flatness condition of the grinding wheel. Furthermore, according to the present invention, a diameter measurement device is disposed inside the platform and measures the roundness of the outer periphery of the grinding wheel. Since the structure can be disassembled easily, the whole measurement device for grinding wheel can be carried conveniently. In addition, measurements can be performed by users on the site where the grinding wheel is located for real-timely understanding the real size and wear condition of grinding wheel.

The present invention provides a measurement device for grinding wheel. One or more thickness measurement device is disposed slidably on a platform. A spinning device is disposed on the platform. A grinding wheel is fixed on the spinning device. The spinning shaft spins the grinding wheel. The one or more thickness measurement device measures the flatness condition of the grinding wheel. Furthermore, according to the present invention, a diameter measurement device is disposed inside the platform and measures the roundness of the outer periphery of the grinding wheel. Since the structure can be disassembled easily, the whole measurement device for grinding wheel can be carried conveniently. In addition, measurements can be performed by users on the site where the grinding wheel is located for real-timely understanding the real size and wear condition of grinding wheel.