A deflectometry device comprising a kinematic spot part holder, a display, an imaging optic, a stop, and a camera imaging assembly including a camera lens and a camera having a detector. Additionally is described, a deflectometry device that is part of a deterministic finishing machine comprising a display, an imaging optic, a stop, and a camera imaging assembly including a camera lens and a camera. Additionally, a method for characterizing material removal created by a deterministic finishing machine is provided.

A CMP polishing apparatus for flattening a quadrate substrate is provided. A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.

A CMP polishing apparatus for flattening a quadrate substrate is provided. A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.

A polishing method capable of improving a spatial resolution of a film-thickness measurement without changing a measuring cycle of a film-thickness sensor and without increasing an amount of measurement data is disclosed. The polishing method includes: rotating a first film-thickness sensor and a second film-thickness sensor together with a polishing table, the first film-thickness sensor and the second film-thickness sensor being located at the same distance from a center of the polishing table; causing the first film-thickness sensor and the second film-thickness sensor to generate signal values indicating film thicknesses at measurement points on a surface of a substrate, while a polishing head is pressing the substrate against a polishing pad on the rotating polishing table, the measurement points being located at different distances from a center of the substrate; and controlling polishing pressure applied from the polishing head to the substrate based on the signal values generated by the first film-thickness sensor and the second film-thickness sensor.

A polishing method capable of improving a spatial resolution of a film-thickness measurement without changing a measuring cycle of a film-thickness sensor and without increasing an amount of measurement data is disclosed. The polishing method includes: rotating a first film-thickness sensor and a second film-thickness sensor together with a polishing table, the first film-thickness sensor and the second film-thickness sensor being located at the same distance from a center of the polishing table; causing the first film-thickness sensor and the second film-thickness sensor to generate signal values indicating film thicknesses at measurement points on a surface of a substrate, while a polishing head is pressing the substrate against a polishing pad on the rotating polishing table, the measurement points being located at different distances from a center of the substrate; and controlling polishing pressure applied from the polishing head to the substrate based on the signal values generated by the first film-thickness sensor and the second film-thickness sensor.

Methods and apparatus for monitoring and controlling relative concentrations of polishing fluid additives and, or, the distribution of a polishing fluid and, or, polishing fluid additives across the surface of a polishing pad during chemical mechanical planarization (CMP) of a substrate are provided herein. In one embodiment, a method for polishing a substrate includes delivering a polishing fluid to one or more locations on a polishing surface of a polishing pad, wherein the polishing fluid comprises an optical marker; detecting optical information at a plurality of locations across a scan region of the polishing surface using an optical sensor facing theretowards; communicating the optical information to a system controller; determining a polishing fluid distribution across the scan region using the optical information; and changing an aspect of the delivery of the polishing fluid based on the polishing fluid distribution.

Methods and apparatus for monitoring and controlling relative concentrations of polishing fluid additives and, or, the distribution of a polishing fluid and, or, polishing fluid additives across the surface of a polishing pad during chemical mechanical planarization (CMP) of a substrate are provided herein. In one embodiment, a method for polishing a substrate includes delivering a polishing fluid to one or more locations on a polishing surface of a polishing pad, wherein the polishing fluid comprises an optical marker; detecting optical information at a plurality of locations across a scan region of the polishing surface using an optical sensor facing theretowards; communicating the optical information to a system controller; determining a polishing fluid distribution across the scan region using the optical information; and changing an aspect of the delivery of the polishing fluid based on the polishing fluid distribution.

A knife sharpener comprises a grinding surface for grinding a blade of the knife when the blade is moved relative to the grinding surface and an observation device including a sensor element and a display element. The sensor element is configured to observe the blade and to collect data regarding the blade when the blade is moved relative to the sensor element. The display element is configured to communicate a condition of the blade to an operator of the observation device. The condition of the blade is based on the data collected by the sensor element when the blade is moved relative to the sensor element.

A knife sharpener comprises a grinding surface for grinding a blade of the knife when the blade is moved relative to the grinding surface and an observation device including a sensor element and a display element. The sensor element is configured to observe the blade and to collect data regarding the blade when the blade is moved relative to the sensor element. The display element is configured to communicate a condition of the blade to an operator of the observation device. The condition of the blade is based on the data collected by the sensor element when the blade is moved relative to the sensor element.

A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.