In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

A method for robotic machining is disclosed. The method includes determining a first designed machining path based on a modelled surface for a target surface to be machined. The method also includes causing a robot to machine the target surface based on the first designed machining path in an adaptive manner to obtain an actual machining path, wherein where the modelled surface is different from the target surface, the robot is caused to follow the target surface. The method further includes determining a second designed machining path for the target surface based on the actual machining path and the first designed machining path.

A probe grinding device by acoustic positioning includes a fixing base, a grinding base, a rotating module, a motor module, a moving module, a processing module, an acoustic sensing module, and a memory module. The fixing base fixes a probe card. The acoustic sensing module generates and transmits an acoustic sensing signal to the processing module. The memory module stores a grinding audio of a grinding audio data. When the processing module drives the rotating module and the moving module via the motor module, the processing module determines whether the acoustic sensing signal matches the grinding audio. When the acoustic sensing signal matches the grinding audio, the processing module drives the moving module to slowly move the grinding base to avoid damaging the probes.

A probe grinding device by acoustic positioning includes a fixing base, a grinding base, a rotating module, a motor module, a moving module, a processing module, an acoustic sensing module, and a memory module. The fixing base fixes a probe card. The acoustic sensing module generates and transmits an acoustic sensing signal to the processing module. The memory module stores a grinding audio of a grinding audio data. When the processing module drives the rotating module and the moving module via the motor module, the processing module determines whether the acoustic sensing signal matches the grinding audio. When the acoustic sensing signal matches the grinding audio, the processing module drives the moving module to slowly move the grinding base to avoid damaging the probes.

A CMP polishing apparatus for flattening a quadrate substrate is provided. A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.

A controller is provided for use in controlling a blade sharpening system that includes at least one grinding wheel operable to sharpen the blade. The controller includes a memory device, and a processor communicatively coupled to the memory device. The processor is configured to receive signals from at least one sensor, the at least one sensor operable to monitor rotation of the at least one grinding wheel. The processor is further configured to adjust a position of the at least one grinding wheel relative to the blade based on the received signals.

A controller is provided for use in controlling a blade sharpening system that includes at least one grinding wheel operable to sharpen the blade. The controller includes a memory device, and a processor communicatively coupled to the memory device. The processor is configured to receive signals from at least one sensor, the at least one sensor operable to monitor rotation of the at least one grinding wheel. The processor is further configured to adjust a position of the at least one grinding wheel relative to the blade based on the received signals.

Method and station for the skiving of the equatorial surface of the casing of a pneumatic tire during a retreading process of the same pneumatic tire; the old worn tread is removed from the pneumatic tire in order to expose the equatorial surface of the casing of the pneumatic tire; the presence of any damage on the equatorial surface of the casing is identified by capturing a three-dimensional profile of the equatorial surface of the casing by means of a laser type profilometer and by analyzing the same three-dimensional profile; and the equatorial surface of the casing is skived where there is damage resulting from the formation of craters on the equatorial surface.

To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

The present invention discloses a wafer polishing device, which comprises a second pressure medium cavity for detecting pressure changes; a porous disc with a plurality of through holes, and its lower surface is covered with a flexible single cavity film; a conduction valve unit for conduction or isolation between the second pressure medium cavity and the third pressure medium cavity, which at least includes a conduction valve seat, a conduction valve and an elastic part. The lower end of the conduction valve seat extends into the through hole, and protrudes from the lower end face of the conduction valve seat; The conduction valve seat, the porous disc and the covered flexible single cavity membrane combined to form the third pressure medium cavity; a first pressure medium cavity.