In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

A processing device with a constant force spindle capable of quickly switching a force control axial direction and a processing method thereof, having a quick-detach unit fixed at a constant force control unit by a first quick-connecting piece, and respectively connecting and moving synchronously with the spindle by a second quick-connecting piece and a third quick-connecting piece, the first quick-connecting piece moves along with a working end of a multi-axial transfer unit, and when combined, a first axial direction that is coaxial with the force control axial direction is defined; alternatively, the first quick-connecting piece moves along with the working end of the multi-axial transfer unit, and when combined, a second axial direction that is coaxial with the force control axial direction is defined, the first axial direction is not parallel to the second axial direction and has an included angle.

A processing device with a constant force spindle capable of quickly switching a force control axial direction and a processing method thereof, having a quick-detach unit fixed at a constant force control unit by a first quick-connecting piece, and respectively connecting and moving synchronously with the spindle by a second quick-connecting piece and a third quick-connecting piece, the first quick-connecting piece moves along with a working end of a multi-axial transfer unit, and when combined, a first axial direction that is coaxial with the force control axial direction is defined; alternatively, the first quick-connecting piece moves along with the working end of the multi-axial transfer unit, and when combined, a second axial direction that is coaxial with the force control axial direction is defined, the first axial direction is not parallel to the second axial direction and has an included angle.

The invention relates to a method for detecting, controlling and automatically compensating pressure in a polishing process, including: detecting a pressure between a polishing wheel and a polished workpiece by a detection shaft or a moment generated on the detection shaft, and outputting the detected pressure or moment to a controller; comparing the detected pressure or moment with a preset pressure or moment and determining whether there is a difference between them; calculating a compensation feeding amount based on the difference and outputting an adjustment signal to an adjustment shaft based on the compensation feeding amount; and moving the adjustment shaft correspondingly based on the adjustment signal so as to drive the polishing wheel or the polished workpiece to move correspondingly to adjust a relative position between the polishing wheel and the polished workpiece so that the difference keeps consistent.

The invention relates to a method for detecting, controlling and automatically compensating pressure in a polishing process, including: detecting a pressure between a polishing wheel and a polished workpiece by a detection shaft or a moment generated on the detection shaft, and outputting the detected pressure or moment to a controller; comparing the detected pressure or moment with a preset pressure or moment and determining whether there is a difference between them; calculating a compensation feeding amount based on the difference and outputting an adjustment signal to an adjustment shaft based on the compensation feeding amount; and moving the adjustment shaft correspondingly based on the adjustment signal so as to drive the polishing wheel or the polished workpiece to move correspondingly to adjust a relative position between the polishing wheel and the polished workpiece so that the difference keeps consistent.

A pipe coating removal apparatus (1) for removing all or some of the coating on a pipe, the pipe coating removal apparatus (1) having a pipe support means (2) for supporting a length of pipe. and further having a tool carriage (3). The tool carriage (3) being capable of supporting two or more different types of pipe coating removal tools (4), (5), (6), (7), (8), (80), (81), (82) and/or (70). The pipe coating removal apparatus (1) being capable of causing relative movement between the tool carriage (3) and the pipe support means (2) to remove all or some of the coating on the pipe that is supportable by the pipe support means (2).

A pipe coating removal apparatus (1) for removing all or some of the coating on a pipe, the pipe coating removal apparatus (1) having a pipe support means (2) for supporting a length of pipe. and further having a tool carriage (3). The tool carriage (3) being capable of supporting two or more different types of pipe coating removal tools (4), (5), (6), (7), (8), (80), (81), (82) and/or (70). The pipe coating removal apparatus (1) being capable of causing relative movement between the tool carriage (3) and the pipe support means (2) to remove all or some of the coating on the pipe that is supportable by the pipe support means (2).

Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.

Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.