Provided is a brush aging pad configured to age a surface protrusion of a brush configured to clean a semiconductor wafer in a chemical mechanical polishing cleaning apparatus, the brush aging pad including a pad body, wherein a roughness of at least one surface of the pad body ranges from 1 m to 5 m.

A polishing apparatus includes: a platen rotatable; a polishing pad disposed on the platen; a polishing head disposed on the polishing pad; a slurry supply disposed above the polishing pad and configured to supply slurry to the polishing pad; a conditioner disposed above the polishing pad and includes a conditioning disk for polishing a surface of the polishing pad; and a collection module disposed above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad. The collection module includes a collection body, and a collection portion disposed within the collection body, and the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers.

A polishing apparatus includes: a platen rotatable; a polishing pad disposed on the platen; a polishing head disposed on the polishing pad; a slurry supply disposed above the polishing pad and configured to supply slurry to the polishing pad; a conditioner disposed above the polishing pad and includes a conditioning disk for polishing a surface of the polishing pad; and a collection module disposed above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad. The collection module includes a collection body, and a collection portion disposed within the collection body, and the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers.

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A water atomizing unit that affixes to a blade sharpening device to cool, lubricate and clean the blade and sharpening disc. The unit pumps atomized water vertically downward and funnels the atomized fluid into a linear spray. The length and shape of the linear spray pattern is set by an elliptical array of bristles affixed to the bottom of the funnel. The spray deposits the clean water uniformly onto the blade and disc, keeping the blade temperature uniform across its length and width. The elliptical bristle array allows atomized water droplets to condense onto the bristles so as to define an elliptical ring of larger dripping water drops. The unit uses ultrasonic atomization in which the water is crushed and torn into small droplets by the energy of ultrasonic oscillation. The ultrasonic atomization is accomplished by a single piezo ultrasonic atomization device powered by a USB configured DC power supply.

A water atomizing unit that affixes to a blade sharpening device to cool, lubricate and clean the blade and sharpening disc. The unit pumps atomized water vertically downward and funnels the atomized fluid into a linear spray. The length and shape of the linear spray pattern is set by an elliptical array of bristles affixed to the bottom of the funnel. The spray deposits the clean water uniformly onto the blade and disc, keeping the blade temperature uniform across its length and width. The elliptical bristle array allows atomized water droplets to condense onto the bristles so as to define an elliptical ring of larger dripping water drops. The unit uses ultrasonic atomization in which the water is crushed and torn into small droplets by the energy of ultrasonic oscillation. The ultrasonic atomization is accomplished by a single piezo ultrasonic atomization device powered by a USB configured DC power supply.

A creep feed grinding apparatus includes a chuck table, a grinding unit having a spindle and a grinding wheel mounted on a lower end of the spindle, the grinding wheel including a plurality of grindstones disposed in an annular array on a surface of an annular base, the grindstones following an annular track upon rotation of the spindle, a moving mechanism for moving the chuck table and the grinding unit relative to each other along a predetermined direction perpendicular to the longitudinal axis of the spindle, and a bottom surface state adjusting mechanism for adjusting states of bottom surfaces of the grindstones by cleaning and/or correcting the bottom surfaces of the grindstones. The bottom surface state adjusting mechanism is positioned outside of a relative movement area of the chick table in which the chuck table and the grinding unit are moved relative to each other by the moving mechanism.