Disclosed herein is an attachment removing device for a diamond tool used in a machining process such as cutting, grinding, polishing, drilling, or the like, for removing an attachment attached to the diamond tool. The attachment removing device for a diamond tool for removing an attachment attached to the diamond tool includes a cylindrical member; and a plurality of bristles each having one end connected to the cylindrical member.

In a substrate processing method according to an embodiment, a surface of an object to be polished disposed on a substrate is polished on a polishing pad supplied with slurry. After the polishing process using the slurry, the surface of the object to be polished on the polishing pad is polished, while supplying water on the polishing pad where a residue including the slurry or a sludge of the polishing pad adhered. After the polishing process using the water, the surface of the object to be polished is cleaned on the polishing pad by supplying rinse liquid on the polishing pad.

In a substrate processing method according to an embodiment, a surface of an object to be polished disposed on a substrate is polished on a polishing pad supplied with slurry. After the polishing process using the slurry, the surface of the object to be polished on the polishing pad is polished, while supplying water on the polishing pad where a residue including the slurry or a sludge of the polishing pad adhered. After the polishing process using the water, the surface of the object to be polished is cleaned on the polishing pad by supplying rinse liquid on the polishing pad.

Apparatus are provided for automatic repositioning of fluid nozzles when operating on a workpiece with a tool. The apparatus includes a nozzle assembly configured to convey a fluid to a target zone defined on the workpiece and/or on the tool. The target zone has a location that varies over time. A spring applies a spring force to bias the nozzle assembly toward the target zone, and moves the nozzle assembly as the location of the target zone varies. The nozzle assembly moves to a position relative to the target zone by a combination of action of the spring force and of any hydrodynamic force of the fluid, when moving through the nozzle assembly.

Apparatus are provided for automatic repositioning of fluid nozzles when operating on a workpiece with a tool. The apparatus includes a nozzle assembly configured to convey a fluid to a target zone defined on the workpiece and/or on the tool. The target zone has a location that varies over time. A spring applies a spring force to bias the nozzle assembly toward the target zone, and moves the nozzle assembly as the location of the target zone varies. The nozzle assembly moves to a position relative to the target zone by a combination of action of the spring force and of any hydrodynamic force of the fluid, when moving through the nozzle assembly.

A method of cleaning a conditioner head includes bringing two clamps of a cleaning tool inward toward a disk-shaped pad conditioner head to press a sponge against an outer surface of the disk-shaped pad conditioner head, and creating relative motion between the cleaning tool and the pad conditioner head to wipe the sponge against the pad conditioner head.

A substrate is reliably suctioned regardless of a flatness of a surface to be suctioned of the substrate. A substrate suction member 330 includes a porous member 334 including a substrate suction surface 334a for suctioning a substrate WF and a pressure reducer 334b communicating with pressure reducing means, a shielding member 332 including a first shielding member 332-1 configured to shield a surface 334c in an opposite side of the substrate suction surface 334a of the porous member 334 and a frame-shaped second shielding member 332-2 configured to shield at least a part of a side surface 334d of the porous member 334, and a frame-shaped elastic seal member 336 attached to the second shielding member 332-2 so as to surround the porous member 334 and provided with a contact surface 336a in contact with the substrate WF.

A substrate is reliably suctioned regardless of a flatness of a surface to be suctioned of the substrate. A substrate suction member 330 includes a porous member 334 including a substrate suction surface 334a for suctioning a substrate WF and a pressure reducer 334b communicating with pressure reducing means, a shielding member 332 including a first shielding member 332-1 configured to shield a surface 334c in an opposite side of the substrate suction surface 334a of the porous member 334 and a frame-shaped second shielding member 332-2 configured to shield at least a part of a side surface 334d of the porous member 334, and a frame-shaped elastic seal member 336 attached to the second shielding member 332-2 so as to surround the porous member 334 and provided with a contact surface 336a in contact with the substrate WF.

The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.