A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

Disclosed in the present invention is a polishing pad conditioning apparatus, comprising: a connecting arm that horizontally extends; a finishing head unit, provided at one end of the connecting arm and used for finishing a polishing pad; and a base unit, provided at the other end of the connecting arm, movably connected to the connecting arm, and used for driving the connecting arm to drive the finishing head unit to vertically move up and down, so that the finishing head unit is close to or far away from the polishing pad in a direction tending to be perpendicular to the polishing pad. The present invention can stably achieve uniform and stable positive pressure in a finishing process and ensure the consistency of a polishing finishing process.

An application device is configured to clean grinding surfaces in a machine for grinding ophthalmic lenses, the application device including: a central portion having so as to mount the application device in the grinding machine; and a peripheral edge configured to receive an application surface to cooperate with the grinding surface of the grinding wheel so as to clean the grinding surface. It also relates to a cleaning kit including an application device and a cleaning solution, and to a method for cleaning grinding surfaces.

A grinding liquid trough arrangement for a grinding machine having a grindstone, wherein said grinding liquid trough arrangement comprises: a trough for grinding liquid formed by a trough wall, wherein the trough is configured to be arranged at a grinding machine having a grindstone such that the trough encloses a portion of a grindstone, wherein, the trough wall comprises at least one metal element which is attractable to magnets, and that, the grinding liquid trough arrangement comprises at least one magnetic element which is configured to be detachable attached to an external side of the trough wall by means of magnetic attraction between the magnetic element and the metal element.

A grinding machine comprising a housing having a base for supporting the grinding machine, a shaft for holding a grindstone, a motor for rotating the shaft and a trough holder for holding a trough for grinding liquid, the through holder being arranged below the shaft, wherein the trough holder is movable in vertical direction between the base of the housing and the shaft for holding a grindstone and that the grinding machine comprises a lifting/lowering arrangement for moving the trough holder in said vertical direction.

A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grinding wheel and a regulating wheel comprises a single dressing unit. The dressing unit is located at a lower position between the grinding wheel and the regulating wheel, and thus eliminates the need for right and left dresser spaces for grinding wheels that have most seriously affected the breadthwise dimension of a conventional centerless grinding machine, leading to space saving and a considerable reduction in the breadthwise dimension of the centerless grinding machine.

A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grinding wheel and a regulating wheel comprises a single dressing unit. The dressing unit is located at a lower position between the grinding wheel and the regulating wheel, and thus eliminates the need for right and left dresser spaces for grinding wheels that have most seriously affected the breadthwise dimension of a conventional centerless grinding machine, leading to space saving and a considerable reduction in the breadthwise dimension of the centerless grinding machine.

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

Provided is a brush aging pad configured to age a surface protrusion of a brush configured to clean a semiconductor wafer in a chemical mechanical polishing cleaning apparatus, the brush aging pad including a pad body, wherein a roughness of at least one surface of the pad body ranges from 1 m to 5 m.