A method for repairing a polishing pad in real time includes a trimming step, a detection step, and a reconstruction and analysis step. A surface morphology of the polishing pad is reconstructed through detection, and analysis is performed according to the reconstruction, to ensure that a surface of the polishing pad can recover its function after the surface of the polishing pad is trimmed, so that the polishing pad can be used effectively to reduce costs.

A method for repairing a polishing pad in real time includes a trimming step, a detection step, and a reconstruction and analysis step. A surface morphology of the polishing pad is reconstructed through detection, and analysis is performed according to the reconstruction, to ensure that a surface of the polishing pad can recover its function after the surface of the polishing pad is trimmed, so that the polishing pad can be used effectively to reduce costs.

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.

A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.

Provided herein are polishing pads in which microcapsules that include a polymer material and are dispersed, as well as methods of making and using the same. Such microcapsules are configured to break open (e.g., when the polishing pad is damaged during the dressing process), which releases the polymer material. When contacted with ultraviolet light the polymer material at least partially cures, healing the damage to the polishing pad. Such polishing pads have a longer lifetime and a more stable remove rate when compared to standard polishing pads.

Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods are shown. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.

Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods are shown. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.

A chemical mechanical polishing touch-up tool includes a pedestal configured to support a substrate, a plurality of jaws configured to center the substrate on the pedestal, a loading ring to apply pressure to an annular region on a back side of the substrate on the pedestal, a polishing ring to bring a polishing material into contact with an annular region on a front side of the substrate that is aligned with the annular region on the back side of the substrate, and a polishing ring actuator to rotate the polishing ring to cause relative motion between the polishing ring and the substrate.