Provided is a dressing device for a carrier. The dressing device comprises a dresser, a swing arm, a base and at least one damper. A first end and a second end of the swing arm are coupled to the dresser and the base, respectively, and the at least one damper is disposed inside the swing arm. Any axial vibration of the dresser or the swing arm during dressing for the carrier can be compensated or attenuated by the damper in an active manner properly, so as to make the surface of the carrier flatter and more uniform, which not only improves a removal rate of material and a polishing result of the surface in the subsequent chemical mechanical planarization process, but also prolongs the service life of the carrier. The present disclosure further relates to a polishing system for dressing the carrier by using the said dressing device.

A dresser includes a main body having a stepped surface comprising a plurality of steps, wherein a thickness of the main body at a first step of the plurality of steps is a largest thickness of the main body, and a thickness of the main body at a last step of the plurality of steps is a smallest thickness of the main body; and a plurality of superhard particles disposed on each of the plurality of steps of the stepped surface. The plurality of steps of the stepped surface are different in area, and particle diameters of the superhard particles increase stepwise from the first step of the plurality of steps to the last step of the plurality of steps.

A dresser includes a main body having a stepped surface comprising a plurality of steps, wherein a thickness of the main body at a first step of the plurality of steps is a largest thickness of the main body, and a thickness of the main body at a last step of the plurality of steps is a smallest thickness of the main body; and a plurality of superhard particles disposed on each of the plurality of steps of the stepped surface. The plurality of steps of the stepped surface are different in area, and particle diameters of the superhard particles increase stepwise from the first step of the plurality of steps to the last step of the plurality of steps.

A creep feed grinding apparatus includes a chuck table, a grinding unit having a spindle and a grinding wheel mounted on a lower end of the spindle, the grinding wheel including a plurality of grindstones disposed in an annular array on a surface of an annular base, the grindstones following an annular track upon rotation of the spindle, a moving mechanism for moving the chuck table and the grinding unit relative to each other along a predetermined direction perpendicular to the longitudinal axis of the spindle, and a bottom surface state adjusting mechanism for adjusting states of bottom surfaces of the grindstones by cleaning and/or correcting the bottom surfaces of the grindstones. The bottom surface state adjusting mechanism is positioned outside of a relative movement area of the chick table in which the chuck table and the grinding unit are moved relative to each other by the moving mechanism.

A creep feed grinding apparatus includes a chuck table, a grinding unit having a spindle and a grinding wheel mounted on a lower end of the spindle, the grinding wheel including a plurality of grindstones disposed in an annular array on a surface of an annular base, the grindstones following an annular track upon rotation of the spindle, a moving mechanism for moving the chuck table and the grinding unit relative to each other along a predetermined direction perpendicular to the longitudinal axis of the spindle, and a bottom surface state adjusting mechanism for adjusting states of bottom surfaces of the grindstones by cleaning and/or correcting the bottom surfaces of the grindstones. The bottom surface state adjusting mechanism is positioned outside of a relative movement area of the chick table in which the chuck table and the grinding unit are moved relative to each other by the moving mechanism.

Dressing tool which has profiled elements arranged coaxially with one another and which are each provided with a profile form, which is tapered or the like in its axial cross-section and has working surfaces provided with hard-material particles. The profiled elements are delimited at their outer circumference by at least one generated surface. The dressing tool preferably includes six profiled elements arranged coaxially with one another, and a one-part or two-part metallic main body for the entire dressing tool or for a particular generated surface. The profile forms with the hard-material particles of the profiled elements may be produced by a negative process with a casting compound applied to the particular main body. This dressing tool can thus be used for a profiling of grinding worms extremely productively and precisely and also such that they can be corrected.

Dressing tool which has profiled elements arranged coaxially with one another and which are each provided with a profile form, which is tapered or the like in its axial cross-section and has working surfaces provided with hard-material particles. The profiled elements are delimited at their outer circumference by at least one generated surface. The dressing tool preferably includes six profiled elements arranged coaxially with one another, and a one-part or two-part metallic main body for the entire dressing tool or for a particular generated surface. The profile forms with the hard-material particles of the profiled elements may be produced by a negative process with a casting compound applied to the particular main body. This dressing tool can thus be used for a profiling of grinding worms extremely productively and precisely and also such that they can be corrected.

A coupling mechanism which enables a rotating body to follow an undulation of a polishing surface without generating flutter or vibration of the rotating body, and can finely control a load on the rotating body on a polishing surface in a load range which is smaller than the gravity of rotating body is disclosed. The coupling mechanism includes an upper spherical bearing and a lower spherical bearing disposed between a drive shaft and the rotating body. The upper spherical bearing has a first concave contact surface and a second convex contact surface which are in contact with each other, and the lower spherical bearing has a third concave contact surface and a fourth convex contact surface which are in contact with each other. The first concave contact surface and the second convex contact surface are located above the third concave contact surface and the fourth convex contact surface. The first concave contact surface, the second convex contact surface, the third concave contact surface, the fourth convex contact surface are arranged concentrically.

A chemical-mechanical polishing/planarization pad conditioner body made from diamond-reinforced reaction bonded silicon carbide, with diamond particles protruding or “standing proud” of the rest of the surface, and uniformly distributed on the cutting surface. In one embodiment, the diamond particles are approximately uniformly distributed throughout the composite, but in other embodiments they are preferentially located at and near the conditioning surface. The tops of the diamond particles can be engineered to be at a constant elevation (i.e., the conditioner body can be engineered to be very flat). Exemplary shapes of the body may be disc or toroidal. The diamond particles can be made to protrude from the conditioning surface by preferentially eroding the Si/SiC matrix. The eroding may be accomplished by electrical discharge machining or by lapping/polishing with abrasive.

A chemical-mechanical polishing/planarization pad conditioner body made from diamond-reinforced reaction bonded silicon carbide, with diamond particles protruding or “standing proud” of the rest of the surface, and uniformly distributed on the cutting surface. In one embodiment, the diamond particles are approximately uniformly distributed throughout the composite, but in other embodiments they are preferentially located at and near the conditioning surface. The tops of the diamond particles can be engineered to be at a constant elevation (i.e., the conditioner body can be engineered to be very flat). Exemplary shapes of the body may be disc or toroidal. The diamond particles can be made to protrude from the conditioning surface by preferentially eroding the Si/SiC matrix. The eroding may be accomplished by electrical discharge machining or by lapping/polishing with abrasive.