Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP.

A wet cutting saw for cutting a ground portion, the wet cutting saw including a blade rotatable about an axis, a liquid feed conduit for feeding liquid onto a surface of the blade as it rotates, a frame for carrying the blade and configured to travel over a surface of the ground portion, and a mounting assembly that mounts the blade to the frame, at least part of the mounting assembly pivotable relative to the frame to raise and lower the blade relative to the frame.

A wet cutting saw for cutting a ground portion, the wet cutting saw including a blade rotatable about an axis, a liquid feed conduit for feeding liquid onto a surface of the blade as it rotates, a frame for carrying the blade and configured to travel over a surface of the ground portion, and a mounting assembly that mounts the blade to the frame, at least part of the mounting assembly pivotable relative to the frame to raise and lower the blade relative to the frame.

An arrangement for cooling a spindle bearing or bearings of an abrading apparatus with rotating abrading members is disclosed. This is premised on arranging in the a housing of the abrading apparatus conduits which extend from a spindle bearing chamber wall of the housing to an inner suction chamber wall of the housing. Via such conduits, hot air may be expelled from a spindle bearing chamber of the housing as an overpressure in front of a protruding balancer element of a rotating shaft balancer is discharged from the spindle bearing chamber via a conduit into a suction chamber. Cool air may be conveyed from a suction chamber into the spindle bearing chamber as an underpressure behind the protruding balancer element draws in air from the suction chamber via the conduit to the spindle bearing chamber.

An arrangement for cooling a spindle bearing or bearings of an abrading apparatus with rotating abrading members is disclosed. This is premised on arranging in the a housing of the abrading apparatus conduits which extend from a spindle bearing chamber wall of the housing to an inner suction chamber wall of the housing. Via such conduits, hot air may be expelled from a spindle bearing chamber of the housing as an overpressure in front of a protruding balancer element of a rotating shaft balancer is discharged from the spindle bearing chamber via a conduit into a suction chamber. Cool air may be conveyed from a suction chamber into the spindle bearing chamber as an underpressure behind the protruding balancer element draws in air from the suction chamber via the conduit to the spindle bearing chamber.

The present application discloses a single-point diamond dresser for a grinding wheel based on acoustic emission online monitoring, which includes a support module, an anti-interference module, a compression cooling module and an acoustic emission online monitoring module. An acoustic emission sensor monitors the dressing state of the grinding wheel online; a damping sheet and a damping interlayer greatly reduce external noise interference; a high pressure coolant causes an upward elastic deformation of an elastic spacer and the damping sheet, enlarging a contact force between the acoustic emission sensor and the core and moreover improving a sensitivity of the acoustic emission sensor; the coolant flows through the coolant passages in the core to cool a dressing area; current limiting passages, pressure relief cavities and perforated pressure-relief plates limit flow and reduce a pressure of the coolant, reducing the interference of the coolant on the grinding wheel dressing.

The present application discloses a single-point diamond dresser for a grinding wheel based on acoustic emission online monitoring, which includes a support module, an anti-interference module, a compression cooling module and an acoustic emission online monitoring module. An acoustic emission sensor monitors the dressing state of the grinding wheel online; a damping sheet and a damping interlayer greatly reduce external noise interference; a high pressure coolant causes an upward elastic deformation of an elastic spacer and the damping sheet, enlarging a contact force between the acoustic emission sensor and the core and moreover improving a sensitivity of the acoustic emission sensor; the coolant flows through the coolant passages in the core to cool a dressing area; current limiting passages, pressure relief cavities and perforated pressure-relief plates limit flow and reduce a pressure of the coolant, reducing the interference of the coolant on the grinding wheel dressing.

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.

A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.