The present invention relates to a cooling system comprising a spray unit for spraying a coolant. The present invention further relates to a machining device which comprises a cooling system of this type. The spray unit comprises a flow guide which is coupled on one side to a chamber and is coupled on the other side to one or more channels, where the chamber, the flow guide and the plurality of channels form a closed system for spraying from the channels pressurized coolant fed to the chamber, where the flow guide, the plurality of elongated channels and the chamber are manufactured as an integral part.

A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

A receptacle for a rotating tool includes a rotationally symmetrical, hollow-cylindrical receptacle main body. A through-pipe, which is braced in particular in relation to the receptacle main body, is disposed in a cavity of the receptacle main body so as to be spaced apart from a cylinder barrel of the hollow-cylindrical receptacle main body.

A receptacle for a rotating tool includes a rotationally symmetrical, hollow-cylindrical receptacle main body. A through-pipe, which is braced in particular in relation to the receptacle main body, is disposed in a cavity of the receptacle main body so as to be spaced apart from a cylinder barrel of the hollow-cylindrical receptacle main body.

The grinding disc receptacle has a rotationally symmetrical, hollow-cylindrical receptacle main body. A through-pipe, which is braced in particular in relation to the receptacle main body, is disposed in the cavity of the receptacle main body so as to be spaced apart from the cylinder barrel of the hollow-cylindrical receptacle main body.

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

A device for connecting a cooling nozzle to a cooling lubricant supply for a grinding machine includes a central axis, a housing arranged for receiving the cooling nozzle, a rotary-linear transmission and a tube section. The rotary-linear transmission has a drive element, pivotable about the central axis, and a manual lever fixed to the drive element. The tube section is rotationally fixed in the housing and movable along the central axis by the rotary-linear transmission to be pressed against the cooling nozzle. The rotary-linear transmission may be a self-locking transmission. The drive element may have a thread structure which extends over less than a full revolution.

A device for connecting a cooling nozzle to a cooling lubricant supply for a grinding machine includes a central axis, a housing arranged for receiving the cooling nozzle, a rotary-linear transmission and a tube section. The rotary-linear transmission has a drive element, pivotable about the central axis, and a manual lever fixed to the drive element. The tube section is rotationally fixed in the housing and movable along the central axis by the rotary-linear transmission to be pressed against the cooling nozzle. The rotary-linear transmission may be a self-locking transmission. The drive element may have a thread structure which extends over less than a full revolution.