A wet cutting saw for cutting a ground portion, the wet cutting saw including a blade rotatable about an axis, a liquid feed conduit for feeding liquid onto a surface of the blade as it rotates, a frame for carrying the blade and configured to travel over a surface of the ground portion, and a mounting assembly that mounts the blade to the frame, at least part of the mounting assembly pivotable relative to the frame to raise and lower the blade relative to the frame.

A wet cutting saw for cutting a ground portion, the wet cutting saw including a blade rotatable about an axis, a liquid feed conduit for feeding liquid onto a surface of the blade as it rotates, a frame for carrying the blade and configured to travel over a surface of the ground portion, and a mounting assembly that mounts the blade to the frame, at least part of the mounting assembly pivotable relative to the frame to raise and lower the blade relative to the frame.

According to the present invention, there is provided a slurry supply system including: a slurry mixing unit configured to mix slurry; a slurry supply unit in which the slurry mixed in the slurry mixing unit is stored and configured to supply the slurry to a polishing apparatus; a pipe configured to connect the slurry mixing unit and the slurry supply unit; and a slurry cooling unit installed in at least one of pipes configured to connect the slurry supply unit and the polishing apparatus to cool down the mixed slurry.

A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding mechanism, a polishing head, and a head cleaning device configured to supply the cleaning liquid to the polishing head to clean the polishing head during polishing and/or after polishing of the substrate.

A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

A system for honing a shaft is provided. The system includes a rod having an axis and a head coupleable to the rod. The system also includes a drive motor coupleable to the rod such that the rod and the head are rotatable via the drive motor. The system further includes a linear actuator coupleable to the rod such that the rod and the head are translatable along the axis while being rotated via the drive motor.

Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.

Described are various coolant and/or lubricating compositions. Also described are various methods for grinding glass that employ such a coolant and/or lubricating composition. Such compositions may find use in the grinding of glass, such as automotive glass, flat glass, ophthalmic glass, precision ophthalmic glass, ceramics, quartz, solar glass, precision optical glass, lens glass, architectural glass, curtain wall glass, appliance glass, electronic-device glass, and/or various plastics.

Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the same. More specifically, implementations of the present disclosure relate to in-situ temperature control with a condensed gas during a chemical-mechanical polishing (CMP) process. In one implementation, the method comprises polishing one or more substrates against a polishing surface in the presence of a polishing fluid during a polishing process to remove a portion of a material formed on the one or more substrates. A temperature of the polishing surface is monitored during the polishing process. Carbon dioxide snow is delivered to the polishing surface in response to the monitored temperature to maintain the temperature of the polishing surface at a target value during the polishing process.

Containment and exhaust systems for substrate polishing components are disclosed. In one aspect, a substrate carrier head, includes a polishing pad, a substrate carrier head configured to retain a wafer against the polishing pad, an atomizer configured to atomize a liquid and spread a layer of the atomized liquid over a surface area of the polishing pad, and a chamber configured to contain and exhaust the atomized liquid.