A method for the surface treatment of workpieces by means of abrasive media, and a surface treatment composition. The method comprises the steps of providing a treatment tool, providing an abrasive medium, supplying a workpiece having a surface to be treated, surface treating the workpiece, involving removal of material and producing waste products, and processing the waste products, wherein at least one of said steps comprises adding an additive to lower a self-ignition tendency on the part of the waste products, the additive comprising a salt, composed of a carbonate and/or of a halogen anion.

A method for the surface treatment of workpieces by means of abrasive media, and a surface treatment composition. The method comprises the steps of providing a treatment tool, providing an abrasive medium, supplying a workpiece having a surface to be treated, surface treating the workpiece, involving removal of material and producing waste products, and processing the waste products, wherein at least one of said steps comprises adding an additive to lower a self-ignition tendency on the part of the waste products, the additive comprising a salt, composed of a carbonate and/or of a halogen anion.

Disclosed are a cooling water circulating system and a cooling water circulating control method. The cooling water circulating system comprises a main tank (2) disposed as a water supply, and a first return pipeline (9) allowing water in a glass edge grinding machine (1) to return to the main tank (2); the main tank (2) is communicated with the glass edge grinding machine (1) through a water supply pipeline; the cooling water circulating system further comprises a filtering mechanism which is configured to filter and collect glass powder in circulating water.

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

A magnetic drum including a plurality of magnets mounted along a circumferential direction on a holder. The magnets are disposed such that magnetic pole surfaces face each other along the circumferential direction on the holder, and the magnets are engaged with the holder so as not to move in a radial direction.

Disclosed is a technology being implemented in an apparatus for coating a substrate with swarf particles. The apparatus facilitates depositing metal coating onto metal surfaces, polymers, and ceramics. In this apparatus, the grinding process is retrofitted to deposit coatings onto substrates that range from soft (e.g., polymers and aluminium) to hard (e.g., glass-ceramic) materials. The apparatus comprises a sample holder, an infeed, and a grinding wheel. The sample holder holds a substrate to be coated with swarf particles. The infeed holding a work piece. The grinding wheel is mounted at a predefined height over the infeed. The apparatus is used to perform metal coating by depositing the swarf materials on surface of the substrate. It may be noted that the swarf materials are generated by grinding the work piece with the grinding wheel.

A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.