An abrading device includes a funnel and an outlet orifice disposed within the funnel for passage of abrasive material, where a distance between the outlet orifice and a bottom end of the funnel is adjustable. An exhaust tube is coupled to the funnel for withdrawal of spent abrasive material from the funnel.

An abrading device includes a funnel and an outlet orifice disposed within the funnel for passage of abrasive material, where a distance between the outlet orifice and a bottom end of the funnel is adjustable. An exhaust tube is coupled to the funnel for withdrawal of spent abrasive material from the funnel.

An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.

An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.

The present invention relates to a device for polishing a specimen (104, 204). The device comprises a polishing platen (101, 201) rotatable about an axis, a polishing pad (103, 203) attached to the polishing platen (101, 201), a specimen holder (105, 205) for holding the specimen (104, 204) against the polishing pad (103, 203), means (107, 110, 207, 212) for measuring a physical quantity in a plurality of positions on the polishing pad (103, 203), the physical quantity being indicative of the moisture or the friction, and means (116, 119, 120, 121, 213, 215, 216, 217) for dispensing a polishing suspension, based on values of the measured physical quantity, to the plurality of positions on the polishing pad (103, 203). The invention also relates to a method for polishing a specimen (104, 204).

The present invention relates to a device for polishing a specimen (104, 204). The device comprises a polishing platen (101, 201) rotatable about an axis, a polishing pad (103, 203) attached to the polishing platen (101, 201), a specimen holder (105, 205) for holding the specimen (104, 204) against the polishing pad (103, 203), means (107, 110, 207, 212) for measuring a physical quantity in a plurality of positions on the polishing pad (103, 203), the physical quantity being indicative of the moisture or the friction, and means (116, 119, 120, 121, 213, 215, 216, 217) for dispensing a polishing suspension, based on values of the measured physical quantity, to the plurality of positions on the polishing pad (103, 203). The invention also relates to a method for polishing a specimen (104, 204).

An abrasive solution for finishing a metal part is provided. The abrasive solution includes abrasive particles suspended in a solution. The abrasive particles are configured to abrade a surface of the metal part. The abrasive particles are substantially non-responsive to a magnetic field. The abrasive solution also includes magnetic particles suspended in the solution. The magnetic particles are configured to respond to a magnetic field by aggregating together such that a local flow pattern of the solution changes in response to the aggregated magnetic particles.

The present invention relates to accessories. Specifically, the present invention relates to cleaning accessories such as jewelry that have small crevices, impressions, engravings, or other fine details that are difficult to reach and clean. Even more specifically, the present invention relates to polishing and drying the cleaned accessories by using an allotment of polishing compound and/or steam.

The present invention relates to accessories. Specifically, the present invention relates to cleaning accessories such as jewelry that have small crevices, impressions, engravings, or other fine details that are difficult to reach and clean. Even more specifically, the present invention relates to polishing and drying the cleaned accessories by using an allotment of polishing compound and/or steam.

The present disclosure provides a wet chemical heating system, including a first conduit for transporting wet chemical, a dispensing head connected to the first conduit, and a radiative heating element configured to heat the wet chemical in the first conduit and positioned at an upper stream of the dispensing head.