Patent classifications
B24B57/02
SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD
A slurry supply device includes; a slurry distribution part configured to dispense slurry, and a support part connected to the slurry distribution part and configured to support the slurry distribution part. The slurry distribution part includes; a guide bar including a slot extending in a first direction, a distribution bar inserted into the slot and including a distribution channel extending in the first direction, the distribution channel being recessed upwardly from a bottom surface of the distribution bar, and a slurry delivery member configured to deliver slurry to the distribution channel.
SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD
A slurry supply device includes; a slurry distribution part configured to dispense slurry, and a support part connected to the slurry distribution part and configured to support the slurry distribution part. The slurry distribution part includes; a guide bar including a slot extending in a first direction, a distribution bar inserted into the slot and including a distribution channel extending in the first direction, the distribution channel being recessed upwardly from a bottom surface of the distribution bar, and a slurry delivery member configured to deliver slurry to the distribution channel.
Polishing apparatus and polishing method
Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.
Polishing apparatus and polishing method
Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.
Apparatus and method for chemical mechanical polishing
A chemical mechanical polishing apparatus includes a cleaning unit that cleans a substrate, a brushing unit that includes a plurality of roll brushes brushing the substrate and a driver driving the roll brushes, and a controlling unit that controls the driver. The controlling unit includes a time calculator that counts a usage time of the roll brushes, and a drive controller that reduces a distance between the roll brushes, based on the usage time of the roll brushes.
Apparatus and method for chemical mechanical polishing
A chemical mechanical polishing apparatus includes a cleaning unit that cleans a substrate, a brushing unit that includes a plurality of roll brushes brushing the substrate and a driver driving the roll brushes, and a controlling unit that controls the driver. The controlling unit includes a time calculator that counts a usage time of the roll brushes, and a drive controller that reduces a distance between the roll brushes, based on the usage time of the roll brushes.
POLISHING LIQUID SUPPLY SYSTEM, POLISHING APPARATUS, EXHAUSTING METHOD AND POLISHING METHOD
A polishing liquid supply system, polishing apparatus, exhausting method and polishing method are provided. The system includes a polishing liquid filter; a sensor for detecting whether there are bubbles in the polishing liquid filter; a controller which is connected to the polishing machine and the sensor, and configured to send an exhaust signal when the polishing machine is in an idle state and the sensor detects that there are bubbles in the polishing liquid filter; and an exhaust unit which includes an exhaust pipeline and a control valve, wherein the exhaust pipeline is in communication with the inside of the polishing liquid filter, and the control valve is arranged on the exhaust pipeline and is connected to the controller for opening after receiving the exhaust signal so as to exhaust the bubbles.
POLISHING LIQUID SUPPLY SYSTEM, POLISHING APPARATUS, EXHAUSTING METHOD AND POLISHING METHOD
A polishing liquid supply system, polishing apparatus, exhausting method and polishing method are provided. The system includes a polishing liquid filter; a sensor for detecting whether there are bubbles in the polishing liquid filter; a controller which is connected to the polishing machine and the sensor, and configured to send an exhaust signal when the polishing machine is in an idle state and the sensor detects that there are bubbles in the polishing liquid filter; and an exhaust unit which includes an exhaust pipeline and a control valve, wherein the exhaust pipeline is in communication with the inside of the polishing liquid filter, and the control valve is arranged on the exhaust pipeline and is connected to the controller for opening after receiving the exhaust signal so as to exhaust the bubbles.
FLUID DISPENSING DEVICE WITH COUPLING TO POWER-DRIVEN TURNING TOOLS AND TURNING TOOL COMPRISING THE SAME
The present invention refers to a device that is coupled to motorised tools whose consumable or implement rotates, preferably tools of the portable or swivelling type, supplying fluids either to the surface on which the consumable or implement acts, or to the consumable or implement itself so that it performs its function correctly, having a reservoir in which pressure is generated for its use and the device and the tool or consumable that is used being independent and interchangeable, and having conventional means of attachment that allow it to be used in conventional tools without having to adapt the tool, the consumable or implement.
FLUID DISPENSING DEVICE WITH COUPLING TO POWER-DRIVEN TURNING TOOLS AND TURNING TOOL COMPRISING THE SAME
The present invention refers to a device that is coupled to motorised tools whose consumable or implement rotates, preferably tools of the portable or swivelling type, supplying fluids either to the surface on which the consumable or implement acts, or to the consumable or implement itself so that it performs its function correctly, having a reservoir in which pressure is generated for its use and the device and the tool or consumable that is used being independent and interchangeable, and having conventional means of attachment that allow it to be used in conventional tools without having to adapt the tool, the consumable or implement.