The present invention discloses an automatic sandpaper replacement device for CNC production line, comprising an automatic sandpaper supply mechanism which comprises a bracket assembly, and a sandpaper receiving assembly and a sandpaper extracting plate disposed on bracket assembly; and an automatic sandpaper peeling mechanism that is mated with bracket assembly, and comprises a mounting plate, and a peeling drive assembly and a peeling assembly mounted on mounting plate; wherein peeling assembly is drivingly connected with peeling drive assembly, peeling assembly periodically peels off waste sandpaper on a sanding head under driving of peeling drive assembly, and sandpaper extracting plate periodically supplies new sandpaper to sanding head after peeling off sandpaper. The automatic sandpaper replacement device improves peeling efficiency, effectively solves problems of uncleanly peeling and peeling residue, saves cost, solves sandpaper jamming problem in a sandpaper supply process, and improves sandpaper replacement efficiency and success rate, thereby further improving productivity.

The present invention discloses an automatic sandpaper replacement device for CNC production line, comprising an automatic sandpaper supply mechanism which comprises a bracket assembly, and a sandpaper receiving assembly and a sandpaper extracting plate disposed on bracket assembly; and an automatic sandpaper peeling mechanism that is mated with bracket assembly, and comprises a mounting plate, and a peeling drive assembly and a peeling assembly mounted on mounting plate; wherein peeling assembly is drivingly connected with peeling drive assembly, peeling assembly periodically peels off waste sandpaper on a sanding head under driving of peeling drive assembly, and sandpaper extracting plate periodically supplies new sandpaper to sanding head after peeling off sandpaper. The automatic sandpaper replacement device improves peeling efficiency, effectively solves problems of uncleanly peeling and peeling residue, saves cost, solves sandpaper jamming problem in a sandpaper supply process, and improves sandpaper replacement efficiency and success rate, thereby further improving productivity.

A tank assembly. The tank assembly comprises a shell, a plurality of conical dispensers, a plurality of drawtubes, a plurality of drawtube apertures, a slurry reservoir, one or more spray equipment and a slurry mixture. The slurry reservoir comprises a fluid reservoir within the shell of the tank assembly. The slurry reservoir comprises an upper reservoir and a conical dispensers reservoir. The conical dispensers reservoir can comprise a fluid space within the plurality of conical dispensers. each among the plurality of drawtubes comprise a drawtube axis. The plurality of drawtubes comprise at least a first drawtube and a second drawtube.

A tank assembly. The tank assembly comprises a shell, a plurality of conical dispensers, a plurality of drawtubes, a plurality of drawtube apertures, a slurry reservoir, one or more spray equipment and a slurry mixture. The slurry reservoir comprises a fluid reservoir within the shell of the tank assembly. The slurry reservoir comprises an upper reservoir and a conical dispensers reservoir. The conical dispensers reservoir can comprise a fluid space within the plurality of conical dispensers. each among the plurality of drawtubes comprise a drawtube axis. The plurality of drawtubes comprise at least a first drawtube and a second drawtube.

The invention relates to a method for adjusting or operating a particle-metering system for a particle blasting installation, in particular a blasting installation for the working of surfaces, the abrasive throughput of which is preset by means of a passing-through opening that can be varied on the basis of time and/or variables and is determined by means of a downstream throughput sensor as a throughput sensor signal (DS), wherein the throughput sensor signal (DS) is used for controlling a manipulated variable (SG) for the degree of setting of the passing-through opening, wherein to adjust the metering system for at least one value of the manipulated variable (SG) the actual throughput (D) through the passing-through opening is determined by means of a measurement of the weight of abrasive material (M) allowed through within a defined time period (Dt), and the manipulated variable (SG), the actual throughput (D) and the corresponding throughput sensor signal (DS) are stored in an assignment table, wherein the relations between the actual throughput (D), the manipulated variable (SG) and the throughput sensor signal (DS) are used during subsequent operation.

The invention relates to a method for adjusting or operating a particle-metering system for a particle blasting installation, in particular a blasting installation for the working of surfaces, the abrasive throughput of which is preset by means of a passing-through opening that can be varied on the basis of time and/or variables and is determined by means of a downstream throughput sensor as a throughput sensor signal (DS), wherein the throughput sensor signal (DS) is used for controlling a manipulated variable (SG) for the degree of setting of the passing-through opening, wherein to adjust the metering system for at least one value of the manipulated variable (SG) the actual throughput (D) through the passing-through opening is determined by means of a measurement of the weight of abrasive material (M) allowed through within a defined time period (Dt), and the manipulated variable (SG), the actual throughput (D) and the corresponding throughput sensor signal (DS) are stored in an assignment table, wherein the relations between the actual throughput (D), the manipulated variable (SG) and the throughput sensor signal (DS) are used during subsequent operation.

A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal. The controller is a processor and the instructions are stored on a non-transitory computer-readable medium and executed by the processor

A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal. The controller is a processor and the instructions are stored on a non-transitory computer-readable medium and executed by the processor

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.