A method of processing a polycrystalline diamond element may include providing a protective leaching cup having a rear wall, an opening defined by a portion of the protective leaching cup opposite the rear wall, and a side wall extending between the opening and the rear wall, the side wall and the rear wall defining a cavity within the protective leaching cup. The method may further include positioning a polycrystalline diamond element in the cavity defined within the protective leaching cup. Positioning the polycrystalline diamond element in the cavity may include expanding at least a portion of the opening outward from a center of the opening. The method may additionally include exposing at least a portion of the polycrystalline diamond element to a leaching agent.

A cutting element (1) for a tool with an electrically conductive track (6) formed at a surface region. The cutting element (1) comprises a HPHT produced polycrystalline diamond body. The conductive track (6) comprises graphite such that the electrically conductive track (6) has an electrical resistance substantially lower than that of the surface region.

A polycrystalline diamond compact including a cemented carbide substrate and a polycrystalline diamond layer bonded to the cemented carbide substrate. The polycrystalline diamond layer is nonplanar and includes a central part and a peripheral part surrounding the central part. The central part includes a protruding surface relative to the peripheral part. The protruding surface is spherical or planar. The peripheral part includes a plurality of radially-disposed ridges.

Embodiments of the invention relate to methods of removing interstitial constituents from superabrasive bodies using an ionic transfer medium, and systems and apparatuses for the same.

A synthetic grindstone (100) for chemo-mechanical grinding a wafer S, comprising: an abrasive (101) that contains cerium oxide having an average particle diameter of 10 μm or less as a main component and has a chemo-mechanical grinding action on the wafer S; a friction promoter (102) that contains a fiber material having a Mohs hardness lower than that of the wafer S and a high friction coefficient as a main component and promotes heat generation; and a binder (103) that contains a phenol resin as a main component and disperses and binds the abrasive (101) and the friction promotor (102).

The present disclosure is directed to an alpha alumina powder having a specific surface area, a specific crystallite size, and a specific particle size distribution for use in abrasive polishes, and method of making such powder. The method of making the alpha alumina powder can include calcining an aluminum oxide precursor powder at a temperature of 800-1500° C. and milling the calcined powder to the specific particle size distribution. The alpha alumina powder disclosed herein can quickly enable high removal rate with undiminished aesthetic quality when used in abrasive polishes.

In one embodiment, an abrasive body can comprise a first surface having a first developed interfacial area ratio (Sdr1) and a second surface having a second developed interfacial area ratio (Sdr2), and wherein the Sdr1 is at least 35% different than the Sdr2.

Shaped abrasive particles each having a sloping sidewall. Each of the shaped abrasive particles containing alpha alumina and having a first face and a second face separated by a thickness, t. The shaped abrasive particles further having a draft angle α between the second face and the sloping sidewall, and the draft angle α is between about 95 degrees to about 125 degrees.

The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.

A cutting tool comprises a substrate and a coating that coats the substrate, the coating including an -alumina layer, the -alumina layer including crystal grains of -alumina, the -alumina layer including a lower portion and an upper portion, the upper portion being occupied in area at a ratio of 50% or more by crystal grains of -alumina having (006) plane with a normal thereto having a direction within 15 with respect to a direction of a normal to the second interface, the lower portion being occupied in area at a ratio of 5% or more and less than 50% by crystal grains of -alumina having (012) plane, (104) plane, (110) plane, (113) plane, (116) plane, (300) plane, (214) plane and (006) plane each with a normal thereto having a direction within 15 with respect to the direction of the normal to the second interface.