An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.

A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation.

A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation.

A grinding head assembly for a floor processing machine includes a plate that has a first side that has a tool attachment surface and a second side opposite the first side. A plurality of lippage adapters are attached to the second side of the plate. The plurality of lippage adapters each include a base portion that have a tool contact surface partially surrounded at a perimeter wall and are removably attached to the second side of the plate with at least one fastener. Each of the plurality of lippage adapters includes at least one magnet fixed to the base portion.

An abrasive segment can include an inner segment portion, an outer segment portion, and a central segment portion connected thereto. The inner segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The outer segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The central segment portion can include a leading radial sidewall and a trailing radial sidewall. The leading radial sidewall of the central segment portion can establish an acute angle, , with respect to the outer circumferential wall of the inner segment portion and an obtuse angle, , with respect the inner circumferential wall of the outer segment portion.

Disclosed are grinding wheels, back-grinding apparatuses, and abrasive article manufacturing methods. The grinding wheel comprises a wheel body having a disk shape and an abrasive article combined with one surface of the wheel body. The abrasive article includes an abrasive body and a plurality of grinding particles in the abrasive body. The abrasive body provides a groove hole that is recessed in a first direction as a horizontal direction on a lateral surface of the abrasive body. A length in the first direction of the groove hole is less than a width in the first direction of the abrasive body.

Disclosed are grinding wheels, back-grinding apparatuses, and abrasive article manufacturing methods. The grinding wheel comprises a wheel body having a disk shape and an abrasive article combined with one surface of the wheel body. The abrasive article includes an abrasive body and a plurality of grinding particles in the abrasive body. The abrasive body provides a groove hole that is recessed in a first direction as a horizontal direction on a lateral surface of the abrasive body. A length in the first direction of the groove hole is less than a width in the first direction of the abrasive body.

An abrasive segment can include an inner segment portion, an outer segment portion, and a central segment portion connected thereto. The inner segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The outer segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The central segment portion can include a leading radial sidewall and a trailing radial sidewall. The leading radial sidewall of the central segment portion can establish an acute angle, , with respect to the outer circumferential wall of the inner segment portion and an obtuse angle, , with respect the inner circumferential wall of the outer segment portion.

Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compressible layer is greater than the maximum height of the discrete abrasive elements, which may provide more even wafer removal rates for in-situ polishing processes.

A conditioning disk with microfeatures is described. More specifically, a conditioning disk with at least one discrete abrasive element and at least one microfeature. The asymmetry of the at least one microstructure may enable, based on orientation, a wide range of pad polishing parameters, such as surface roughness and pad wear rate.