A high-rotational speed cup-shaped grinding wheel includes an annular base, several blades and a flow splitting structure. The blades are fixed on a side of the base at an interval in a circumferential direction to form a blade ring. The side of the blade ring away from the base forms an annular working surface, and two adjacent blades are spaced apart from each other to form a water passage channel for delivering cooling water to the working surface. The flow splitting structure is fixed on the blade ring and splits the cooling water into two branches, where a first branch delivers the cooling water to an outer area of the working surface, and a second branch delivers the cooling water to an inner area of the working surface, and then delivers the cooling water from an inner area of the working surface to an outer side area thereof.

Disclosed herein is a grinding wheel including a wheel base to be fixed to a spindle, a plurality of abrasive members fixed to the wheel base, and a plurality of grinding water supply holes for supplying a grinding water to the abrasive members. Each abrasive member is formed as a segment abrasive having an outer surface extending downward from the lower surface of the wheel base so as to be inclined radially outward. The plural abrasive members are arranged annularly at given intervals. The plural grinding water supply holes are formed on the lower surface of the wheel base in the vicinity of the abrasive members so as to each correspond to the abrasive members in the condition where each grinding water supply hole lies on a line connecting the corresponding abrasive member and the axis of rotation of the wheel base.

Disclosed herein is a grinding wheel including a wheel base to be fixed to a spindle, a plurality of abrasive members fixed to the wheel base, and a plurality of grinding water supply holes for supplying a grinding water to the abrasive members. Each abrasive member is formed as a segment abrasive having an outer surface extending downward from the lower surface of the wheel base so as to be inclined radially outward. The plural abrasive members are arranged annularly at given intervals. The plural grinding water supply holes are formed on the lower surface of the wheel base in the vicinity of the abrasive members so as to each correspond to the abrasive members in the condition where each grinding water supply hole lies on a line connecting the corresponding abrasive member and the axis of rotation of the wheel base.

The disclosed technology includes a cutting tool comprising segments arranged around a periphery of a cutting tool. Each segment, of the plurality of segments comprising a first portion comprising a first material having a first hardness, a second portion comprising a second material having a second hardness, the second hardness being less than the first hardness, and a transition region. The transition region can include at least part of the first material and at least part of the second material. The transition region can have an overall third hardness that is less than the first hardness and greater than the second hardness. A first segment and a second segment of the plurality of segments can be attached to the periphery of the cutting tool such that at least the first portion of the first segment is aligned in a cutting direction with the second portion of the second segment.

A grinding wheel includes: a wheel body positioned over a wafer; a plurality of wheel tips disposed on the wheel body; and a support block disposed on the wheel body and an outer side surface of each of the wheel tips.

Finishing tool (10) for surface machining slab-like elements. The finishing tool (10) comprises a reusable base (12) and an abrasive component (14) releasably connected to said base (12) in order to be selectively replaced, wherein said abrasive component (14) is provided with an abrasive surface to perform smoothing, lapping and surface finish machining of slab-like elements, for example made of stone material, marble, granite, or ceramic, grs porcelain stoneware or suchlike, or similar materials.

Disclosure relates to a fixed abrasive-grain processing device and a method of fixed abrasive-grain processing used for producing a semiconductor wafer, and a method for producing a semiconductor wafer which make the surface of the semiconductor wafer possible to have preferable flatness and which can prevent the number of steps and the installation area of facilities from increasing. The producing of semiconductor wafers uses a fixed abrasive-grain processing device including a lower fixed abrasive-grain layer that is adjacent to the top surface of the lower surface-plate and that grinds the top surfaces of the plurality of semiconductor wafers; an upper fixed abrasive-grain layer that is adjacent to the bottom surface of the upper surface-plate and that grinds the bottom surfaces of the plurality of semiconductor wafers; a carrier plate that is horizontally interposed between the lower surface-plate and the upper surface-plate and that includes a plurality of holes each accommodating one of the plurality of semiconductor wafers; and a carrier rotating device that circularly moves the carrier plate, wherein the lower fixed abrasive-grain layer and the upper fixed abrasive-grain layer include fixed abrasive grain having a diameter of 4 m or less and being dispersed and fixed in elastic members.

Disclosure relates to a fixed abrasive-grain processing device and a method of fixed abrasive-grain processing used for producing a semiconductor wafer, and a method for producing a semiconductor wafer which make the surface of the semiconductor wafer possible to have preferable flatness and which can prevent the number of steps and the installation area of facilities from increasing. The producing of semiconductor wafers uses a fixed abrasive-grain processing device including a lower fixed abrasive-grain layer that is adjacent to the top surface of the lower surface-plate and that grinds the top surfaces of the plurality of semiconductor wafers; an upper fixed abrasive-grain layer that is adjacent to the bottom surface of the upper surface-plate and that grinds the bottom surfaces of the plurality of semiconductor wafers; a carrier plate that is horizontally interposed between the lower surface-plate and the upper surface-plate and that includes a plurality of holes each accommodating one of the plurality of semiconductor wafers; and a carrier rotating device that circularly moves the carrier plate, wherein the lower fixed abrasive-grain layer and the upper fixed abrasive-grain layer include fixed abrasive grain having a diameter of 4 m or less and being dispersed and fixed in elastic members.

A disc-shaped grindstone 1 includes a plurality of split grindstones provided in an outer circumferential surface of a disc-shaped base 3. At least a part of the split grindstones include a moving grindstone 6 which is movable in the axial direction of the disc-shaped base 3. Since a part of the split grindstones 4 is the moving grindstone 6 which is movable in the axial direction, the width of the disc-shaped grindstone 1 may be changed in a manner such that the moving grindstone 6 is moved in the axial direction. Accordingly, it is possible to promptly handle a plurality of kinds of grinding targets without replacing the disc-shaped grindstone 1.