A brush assembly is provided for increasing an effective area and uniformity of performance in an abrasive floor polishing application at a given size of brush mount. The brush assembly includes a pad with slots for receiving abrasive blades. The pad includes variable protrusions to provide varied support to the abrasive blades. The blades have a trapezoidal body shape. The blades include abrading components including an abrasive material such as diamonds. In some embodiments, the abrading components include a metallic material, such as copper material. In some embodiments, the abrading components include a phenolic material.

A brush assembly is provided for increasing an effective area and uniformity of performance in an abrasive floor polishing application at a given size of brush mount. The brush assembly includes a pad with slots for receiving abrasive blades. The pad includes variable protrusions to provide varied support to the abrasive blades. The blades have a trapezoidal body shape. The blades include abrading components including an abrasive material such as diamonds. In some embodiments, the abrading components include a metallic material, such as copper material. In some embodiments, the abrading components include a phenolic material.

A grinding wheel is mounted on a tip end of a spindle and the grinding wheel grinds a workpiece according to rotation of the spindle. The grinding wheel includes an annular base, and a plurality of grindstone sets disposed in an annular manner on one surface side of the base along a circumferential direction of the base. Each of the plurality of grindstone sets has a first grindstone and a second grindstone having a self-sharpening capability lower than that of the first grindstone, such that the first grindstone and the second grindstone are adjacent to each other in a predetermined orientation in the circumferential direction of the base, and a predetermined interval larger than an interval between the first grindstone and the second grindstone in the circumferential direction of the base is provided between adjacent ones of the grindstone sets.

An abrasive wheel includes a wheel body configured to rotate about a rotary shaft, a holder fixed to the wheel body and comprising a plurality of electromagnets, and a plurality of abrasive members configured to grind a substrate, the plurality of abrasive members being detachably fixed respectively to the plurality of electromagnets, where each of the plurality of abrasive members is further configured to be independently replaceable.

There is provided a method of manufacturing package devices, including a first substrate preparing step of preparing a first substrate in which a device chip is mounted in each of a plurality of mounting areas, a second substrate preparing step of preparing a second substrate including a plurality of recessed portions that are capable of housing the device chips, a bonding step of bonding the first substrate and the second substrate together in such a manner that the device chips are housed in the recessed portions, a grinding step of grinding the second substrate until the recessed portions are exposed, a resin molding step of supplying resin to the plurality of recessed portions and covering the device chips by the resin, and a dividing step of dividing the first substrate and the second substrate and manufacturing a plurality of package devices each including the device chips.

A grinding apparatus has a grinding wheel fastened to a mount disk connected a spindle by a plurality of bolts. The mount disk has at least three threaded holes and a plurality of protrusions protruding from a mount surface thereof. Each of the bolts includes an externally threaded shank, a neck coupled to the externally threaded shank, and an engaging flange coupled to the neck and extending radially outwardly. The grinding wheel includes an annular open hole defined in a mating surface of an annular base for mating with the mount surface, an annular slot that is wider than the annular open hole and is fluidly connected to the annular open hole, at least three insertion holes in the annular open hole for allowing the engaging flange to be inserted into the annular slot, and a plurality of protrusion insertion holes for receiving the engaging flanges of the bolts.

Disclosed is a grinding configuration for a substrate grinding apparatus. The grinding configuration includes a grinding disk, multiple first light guides, and multiple second light guides. Multiple mounting holes are penetrated through the grinding disk, with each first light guide and each second light guide being provided in each mounting hole, respectively. Each first light guide and each second light guide is penetrated along its axial direction to form a light channel. Multiple light transmission plates are provided at the lower end of each first light guide and each second light guide, which block the communication between each light channel and the space below the grinding disk, thereby preventing slurry or foam generated during substrate grinding from entering each light channel.

An example trimming tool includes a floating base having a first side and an opposite, second side, a first rail, and a second rail. At least the second side of the floating base, the first rail and the second rail define a workspace having a first opening and a second opening. The trimming tool also includes a milling apparatus, attached to the floating base, having a base on the first side of the floating base and a milling head on the second side of the floating base. The milling head is spring loaded. The floating base and milling apparatus are configured to remove at least a portion of a foam layer in the workspace.

An example trimming tool includes a floating base having a first side and an opposite, second side, a first rail, and a second rail. At least the second side of the floating base, the first rail and the second rail define a workspace having a first opening and a second opening. The trimming tool also includes a milling apparatus, attached to the floating base, having a base on the first side of the floating base and a milling head on the second side of the floating base. The milling head is spring loaded. The floating base and milling apparatus are configured to remove at least a portion of a foam layer in the workspace.

A method produces wafers from a cylindrical ingot of semiconductor material having an axis and an indexing notch in an outer surface of the cylindrical ingot and parallel to the axis. The method includes, in the order specified: (a) simultaneous removal of a multiplicity of sliced wafers from the cylindrical ingot by multi-wire slicing in the presence of a cutting agent; (b) etching of the sliced wafers with an alkaline etchant in an etching bath at a temperature of 20 C. to 50 C. and for a residence time, such that the material removed from each of the sliced wafers is less than 5/1000 of an initial wafer thickness; and (c) grinding of the etched wafers by simultaneous double-disk grinding using an annular abrasive covering.