A tool (1) for surface finish machining, having a cushion (6) made of an elastic plastics foam, on the underside of which there is formed a working medium face (2) having working media or adhesives (8, 11, 12, 13) for the releasable attachment of working medium discs and on the top side of which there is formed a drive receptacle (4, 5) for application of work, is created as a product that is producible easily and non-critically in high volume, is extremely robust in use, is moisture-resistant and is able to withstand high rotational speeds, in that the elastic plastics foam consists of closed-cell expanded and fused-together particles of a thermoplastic elastomer (TPE).

Methods of making abrasive articles involve adhering shaped abrasive particles to a reinforcing member according to a predetermined pattern and optionally orientation, and depositing a space-filling binder precursor on the reinforcing member and shaped abrasive particles to provide a filled abrasive preform, disposing another reinforcing member onto the filled abrasive preform, and curing the abrasive article precursor to form the abrasive articles. In some aspects, multiple abrasive preforms are stacked on each other. Bonded abrasive wheels preparable according to the methods are also disclosed.

According to one embodiment, a method of making an abrasive article is disclosed. The method can comprise: disposing a layer of a curable composition into a mold having a circular mold cavity with a central hub, wherein the circular mold cavity has an outer circumference and a rotational axis extending through the central hub, and wherein the curable composition is comprised of at least some magnetizable abrasive particles dispersed therein; and varying a magnetic field relative to the curable composition such that a majority of the magnetizable abrasive particles are at least one of oriented and aligned in a non-random manner relative to a surface of the mold; and at least partially curing the curable composition to provide the bonded abrasive article.

A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.

A slurry scraping mechanism and an applying and scraping device used in an SG abrasive production process includes a scraping master support; a scraper, wherein the scraper is connected with the scraping master support through a suspension component such that the scraper is suspended, and a damping spring is arranged in the suspension component; and a torsion spring adjusting component, wherein the torsion spring adjusting component includes a plurality of torsion springs supported by a torsion spring support shaft, the torsion spring support shaft is fixed to the scraping master support, the torsion spring support shaft is movable up and down relative to the scraping master support, the torsion springs are clamped in a V-shaped plate, an end side of the V-shaped plate is connected with the scraping master support, and a side surface of the V-shaped plate is connected with the scraper.

The invention relates to a PCD composite compact element comprising a PCD structure integrally bonded at an interface to a cemented carbide substrate; the PCD structure comprising coherently bonded diamond grains having a mean size no greater than 15 microns; the cemented carbide substrate comprising carbide particles dispersed in a metallic binder, the carbide particles comprising a carbide compound of a metal; wherein the ratio of the amount of metallic binder to the amount of the metal at points in the substrate deviates from a mean value by at most 20 percent of the mean value. The invention further relates to a method for making a PDC compact element comprising a PCD structure integrally bonded to a substrate formed of cemented carbide; the method including introducing a source of excess carbon to the substrate at a bonding surface of the substrate to form a carburised substrate; contacting an aggregated mass of diamond grains with the carburised substrate; and sintering the diamond grains in the presence of a solvent/catalyst material for diamond; wherein the mean size of the diamond grains in the aggregated mass is no greater than 30 microns.

A memory device may include one or more memory banks that store data and one or more input buffers. The input buffers may receive command address signals to access the one or more memory banks. The memory device may operate in one of a first mode of operation or a second mode of operation. The one or more input buffers may operate under a first bias current when the memory device is in the first mode of operation or a second bias current when the memory device is in the second mode of operation, and the first bias current may be greater than the second bias current.

The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

A grinding tool has a main body having at least one fiber ply embedded in a binder. An abrasive layer is arranged on the main body. The at least one fiber ply is arranged in the binder in a partially movable manner. As a result, a relative movement that ensures high vibration and noise damping is achieved within the main body and within the at least one fiber ply.