A method for manufacturing a polishing head, includes: forming, on a lower end surface of an intermediate plate, a groove which extends from an inlet of an incompressible fluid to an outer peripheral portion of the intermediate plate and a groove which extends from an outlet of air to the outer peripheral portion of the intermediate plate, also including, after attaching an elastic film to a lower end surface of a rigid ring and coupling an upper end surface of the rigid ring with the lower end surface of the intermediate plate to form a space section: depressurizing the inside of the space section; and discharging the air in the space section from the outlet while pouring the incompressible fluid into the space section from the inlet after the depressurizing, and closing the inlet and outlet to seal the incompressible fluid in the space section.

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.

A roller assembly for a rotary dresser comprise a plurality of axial segments which may be in the form of discs, each disc provided with an abrasive, radially outer surface. The discs are secured in axial alignment, each in a preconfigured rotational orientation. The disc assembly has a centrally arranged aperture for receiving a rotor shaft. The abrasive surface of the assembly can be accurately presented as an array of uniformly shaped abrasive units in a predefined pattern.

A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

A sander for use with a vacuum extraction system is provided. The sander comprises a body, a releasable retention mechanism on an upper surface adjacent each end of the body, a platen, the platen adjacent to and attached to a lower surface of the body and having a pattern of grooves, an at least one vacuum port extending through the body and platen and positioned such that the grooves in the platen are substantially directed to the at least one vacuum port, wherein the improvement comprises a perforated sandpaper sheet, the perforated sandpaper sheet comprising: an upper sandpaper layer; a lower plastic polymer foam layer; and a plurality of apertures in a plurality of series; the plurality of series of apertures in a pattern configured to align with the pattern of grooves in the platen of the sander, the plurality of apertures occupying about 5 percent of an upper surface area of the sandpaper sheet.