A substrate transport apparatus including a transport chamber, a drive section, a robot arm having an end effector at a distal end configured to support a substrate and being connected to the drive section generating at least arm motion in a radial direction extending and retracting the arm, an imaging system with a camera mounted in a predetermined location to image at least part of the robot arm, and a controller connected to the imaging system to image the arm moving to a predetermined repeatable position, the controller effecting capture of a first image of the robot arm proximate to the repeatable position decoupled from encoder data of the drive axis, wherein the controller calculates a positional variance of the robot arm from comparison of the first image with a calibration image, and from the positional variance determines a motion compensation factor changing the extended position of the robot arm.

An apparatus including a robot drive; and a robot arm connected to the robot drive, where the robot arm includes a first link connected to the robot drive, a second link rotatably connected to the first link at a first rotatable connection, and an end effector rotatably connected to the second link at a second rotatable connection. The end effector includes a heat choke located between a substrate support area of the end effector and the second rotatable connection. At least one of the first rotatable connector or the second rotatable connection includes a rotary thermal coupling having interleaved members which are rotatable relative to each other.

A wafer transfer apparatus includes a holding plate having a holding surface adapted to be opposed to one side of a wafer, a suction holding portion provided so as to be exposed to the holding surface for holding the wafer under suction in a noncontact fashion, three or more restricting members for restricting the movement of the wafer in a direction parallel to the one side of the wafer, each restricting member having a roller portion rotatable about its axis, the roller portion being adapted to come into contacted with the peripheral edge of the wafer held under suction by the suction holding portion, and a moving unit connected to the holding plate for moving the holding plate to thereby transfer the wafer. At least one of the restricting members functions as a rotational drive portion for rotating the roller portion about its axis to thereby rotate the wafer.

A substrate processing apparatus includes a process module including a substrate support unit, an inverting unit and a processing unit, and a transfer module, wherein the inverting unit inverts a substrate so that a second surface faces upward, and provides the inverted substrate to the substrate support unit, wherein the processing unit performs a first processing on the second surface of the substrate seated on the substrate support unit, wherein the inverting unit inverts the first processed substrate so that the first surface faces upward, wherein the transfer module takes the substrate with a first surface facing upward out of the process module, and introduces again the substrate with a first surface facing upward into the process module to seat it on the substrate support unit, wherein the processing unit performs a second processing on the first surface of the substrate seated on the substrate support unit.

A robot according to one or more embodiments may include an arm and a hand. The hand is connected to the arm and supports to convey a wafer. The hand includes a base end portion that is an end of the side connected to an arm, and a distal end portion that is an end of the opposite side of the base end portion. With the hand, a lightened part is formed in at least a part of a first region which is a region of a distal end portion than the center part in the longitudinal direction of the hand.

A telepresence robot may include a drive system, a control system, an imaging system, and a mapping module. The mapping module may access a plan view map of an area and tags associated with the area. In various embodiments, each tag may include tag coordinates and tag information, which may include a tag annotation. A tag identification system may identify tags within a predetermined range of the current position and the control system may execute an action based on an identified tag whose tag information comprises a telepresence robot action modifier. The telepresence robot may rotate an upper portion independent from a lower portion. A remote terminal may allow an operator to control the telepresence robot using any combination of control methods, including by selecting a destination in a live video feed, by selecting a destination on a plan view map, or by using a joystick or other peripheral device.

A bonding apparatus and method for correcting movement amount of bonding head are provided. The bonding apparatus performs: mark correction of imaging a reference mark using a position detection camera at every prescribed timing and correcting the amount of movement of a bonding head on the basis of the amount of positional deviation between the position of the imaged reference mark and a reference position of the position detection camera; and actual position correction of detecting the actual bonding position of a semiconductor element after bonding using the position detection camera at every timing when the cumulative value of the amounts of correction of the mark correction from the previous actual position correction exceeds a prescribed first threshold and correcting the amount of movement of the bonding head on the basis of the amount of positional deviation between the detected actual bonding position and a target bonding position.

There is provided an apparatus for transporting a substrate. The apparatus comprises: an end effector including a fork which holds the substrate and a wrist part which holds a proximal end portion of the fork; an arm provided with the end effector installed thereon and a mechanism which moves the fork; and an inclination adjusting mechanism provided between the fork and the wrist part or between the wrist part and the arm to adjust an inclination of the fork.

A wafer jig according to one or more embodiments may be used for a robot having a hand and a state detector. The hand can transport a wafer. The state detector detects a state of a member holding the wafer at the hand or a state of a negative pressure adsorbing the wafer at the hand. The wafer jig includes an information output part. The information output part outputs information to a hand side via the state detector by changing a detection result of the state detector.

A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along a first radial axis; a second SCARA arm connected to the frame, including an end effector, configured to extend and retract along a second radial axis, the SCARA arms having a common shoulder axis of rotation; and a drive section coupled to the SCARA arms is configured to independently extend each SCARA arm along a respective radial axis and rotate each SCARA arm about the common shoulder axis of rotation where the first radial axis is angled relative to the second radial axis and the end effector of a respective arm is aligned with a respective radial axis, wherein each end effector is configured to hold at least one substrate and the end effectors are located on a common transfer plane.