Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.

A system utilizes electroadhesive surfaces for braking and metering objects in an automated environment. An electroadhesive surface can include electrodes that are configured to induce an electrostatic attraction with nearby objects upon application of voltage to the electrodes. The systems described utilize various configurations of electroadhesive surfaces, sensors, controllers and programmable processors to create smart braking, capturing and metering systems for improved automated material handling.

An automated ply layup system uses a robot and an end effector for selecting plies from a kit and placing the plies at predetermined locations on a tool by further employing cameras for ply location detection, a laser scanner for detection and ply placement within a location on the tool, and compact sensors for compacting plies onto the tool.

A transfer head array includes a body and a plurality of transfer heads. The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses. The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.

An apparatus for de-stacking sheet metal blanks uses electro-magnetic pulses to separate sheet metal blanks from a stack of blanks. A fixture supports an electromagnetic attraction device that includes one or more multi-turn electrical coils and one or more insulated metal screens. The coil is electrically connected to a bank of capacitors. The metal screen is disposed in an electrical insulation material and is retained by the fixture between the coil and the top blank of the stack of blanks. Suction cups perform the primary lifting function and are connected to a vacuum source. The suction cups may be supported by the same fixture or another associated fixture that cooperates with the coil and insulated screen.

A method and system for piece-picking or piece put-away within a logistics facility. The system includes a central server and at least one mobile manipulation robot. The central server is configured to communicate with the robots to send and receive piece-picking data which includes a unique identification for each piece to be picked, a location within the logistics facility of the pieces to be picked, and a route for the robot to take within the logistics facility. The robots can then autonomously navigate and position themselves within the logistics facility by recognition of landmarks by at least one of a plurality of sensors. The sensors also provide signals related to detection, identification, and location of a piece to be picked or put-away, and processors on the robots analyze the sensor information to generate movements of a unique articulated arm and end effector on the robot to pick or put-away the piece.

Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.

A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

A method and system for piece-picking or piece put-away within a logistics facility. The system includes a central server and at least one mobile manipulation robot. The central server is configured to communicate with the robots to send and receive piece-picking data which includes a unique identification for each piece to be picked, a location within the logistics facility of the pieces to be picked, and a route for the robot to take within the logistics facility. The robots can then autonomously navigate and position themselves within the logistics facility by recognition of landmarks by at least one of a plurality of sensors. The sensors also provide signals related to detection, identification, and location of a piece to be picked or put-away, and processors on the robots analyze the sensor information to generate movements of a unique articulated arm and end effector on the robot to pick or put-away the piece.