This automaton for applying a patch to a draping surface (15) comprises a gripper (24) capable of grasping the patch and depositing it on the draping surface (15), and a heating system (25) for directly heating the draping surface (15).

Apparatuses, systems, and methods for delicate handling of fragile materials, such as aerogels, fragile sheet-like materials and aerogel sheets.

A present disclosure relates to a shape compliant electroadhesive gripper for picking up atypical objects having various shapes, sizes, and materials, and a shape compliant electroadhesive gripper according to one embodiment of the present disclosure includes a body, a shape compliant module disposed on the body, rigidity of the shape compliant modules being variably controllable, and an electroadhesive module disposed on the shape compliant module.

A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

A gripping apparatus is disclosed for gripping and holding electrically conductive, textile materials. The gripping apparatus includes a gripping device which has a gripping face for gripping and holding the textile material. With the aid of an electrical contact device, electrodes can be brought into contact with the textile material in order to bring about a current flow in the textile material.

A conveyor employs electrostatic force to selectively adhere packages to an inclined conveying surface and selectively release packages from the inclined conveying surface to separate the packages from each other. A pair of electrodes embedded in the body of a conveyor belt module are selectively energized via electrically conductive hinge rods used to connect conveyor belt modules together to generate the electrostatic force.

A device for electroadhesion and conversion of electrical energy into mechanical energy, for example electrostatic actuation, is provided, including a soft polymeric dielectric support having at least two sets of overlapping electrodes patterned respectively on the upper surface and bottom surface of the polymeric support, the electrodes of the two sets can be electrically activated through a power supply for providing voltage change suitable for electroadhesion, electrostatic actuation or both at the same time.

Provided is a composite sintered body for an electrostatic chuck, which is not easily broken even if it is exposed to high-power plasma. Further, provided are an electrostatic chuck device using such a composite sintered body for an electrostatic chuck and a method of manufacturing a composite sintered body for an electrostatic chuck. The composite sintered body for an electrostatic chuck is a composite sintered body including an insulating ceramic and silicon carbide, in which crystal grains of the silicon carbide are dispersed in at least one selected from the group consisting of a crystal grain boundary and a crystal grain of a main phase formed by sintering crystal grains of the insulating ceramic.

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.