Electro-adhesion grippers for holding workpieces, are disclosed as including a first electrode and a second electrode that mutually engage, in a plan view of the electrodes, wherein, at least in a sub-region, the first electrode and the second electrode correspond to the border lines of a two-dimensional fractal space-filling curve of a second or higher order, and wherein the border lines result from enclosing a shape of the space-filling curve on both sides on an auxiliary grid that is offset with respect to a grid of the space-filling curve by half a grid spacing in each grid direction.

An electrostatically-enhanced friction-gripping end effector is an apparatus that quickly and securely moves a semiconductor wafer from one spot to another spot. The apparatus includes a flat effector body, an electrostatic antenna, an antenna controller, and a plurality of gripping pads. The flat effector body is the main weight-bearing structure that is used to support the semiconductor wafer and acts as a base for the other components to be connected together. The electrostatic antenna generates a non-uniform electrostatic field that applies an attractive force onto the semiconductive wafer, while the plurality of gripping pads frictionally grips the semiconductive wafer. The antenna controller provides instructions to turn on, turn off, or modulate the non-uniform electrostatic field.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.

A method and system for piece-picking or piece put-away within a logistics facility. The system includes a central server and at least one mobile manipulation robot. The central server is configured to communicate with the robots to send and receive piece-picking data which includes a unique identification for each piece to be picked, a location within the logistics facility of the pieces to be picked, and a route for the robot to take within the logistics facility. The robots can then autonomously navigate and position themselves within the logistics facility by recognition of landmarks by at least one of a plurality of sensors. The sensors also provide signals related to detection, identification, and location of a piece to be picked or put-away, and processors on the robots analyze the sensor information to generate movements of a unique articulated arm and end effector on the robot to pick or put-away the piece.

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.

A hub assembly for coupling different grasper assemblies including a soft actuator in various configurations to a mechanical robotic components are described. Further described are soft actuators having various reinforcement. Further described are and soft actuators having electroadhesive pads for improved grip, and/or embedded electromagnets for interacting with complementary surfaces on the object being gripped. Still further described are soft actuators having reinforcement mechanisms for reducing or eliminating bowing in a strain limiting layer, or for reinforcing accordion troughs in the soft actuator body.

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively.

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.

A hub assembly for coupling different grasper assemblies including a soft actuator in various configurations to a mechanical robotic components are described. Further described are soft actuators having various reinforcement. Further described are and soft actuators having electroadhesive pads for improved grip, and/or embedded electromagnets for interacting with complementary surfaces on the object being gripped. Still further described are soft actuators having reinforcement mechanisms for reducing or eliminating bowing in a strain limiting layer, or for reinforcing accordion troughs in the soft actuator body.