A method and system for piece-picking or piece put-away within a logistics facility. The system includes a central server and at least one mobile manipulation robot. The central server is configured to communicate with the robots to send and receive piece-picking data which includes a unique identification for each piece to be picked, a location within the logistics facility of the pieces to be picked, and a route for the robot to take within the logistics facility. The robots can then autonomously navigate and position themselves within the logistics facility by recognition of landmarks by at least one of a plurality of sensors. The sensors also provide signals related to detection, identification, and location of a piece to be picked or put-away, and processors on the robots analyze the sensor information to generate movements of a unique articulated arm and end effector on the robot to pick or put-away the piece.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

An end-effector may include a base, a plurality of underactuated fingers coupled to the base; and an adhesion gripper coupled to the base. An end-effector may include a base, an actuator, a first underactuated finger comprising a proximal link and a distal link, the proximal link including a distal end, a guide for a first tendon spaced a first distance away from the distal end of the proximal link and the distal link including a lever arm disposed on a proximal side to the distal pad and which extends in a volar direction from a first axis, and a node disposed on the lever arm sized and shaped to receive a first tendon. The end-effector may include a first revolute joint compliant in a first direction disposed between the base and the proximal link; and a second revolute joint compliant in the first direction disposed between the proximal link and the distal link.

A micro device transfer system includes a transfer head having pick-up electrodes for picking micro devices and thin-film transistors (TFTs) corresponding to the pick-up electrodes; a transfer head holder for holding the transfer head; a TFT driver board electrically connected to control the TFTs; a donor or acceptor substrate for carrying the micro devices; and a substrate holder for holding the donor or acceptor substrate.

A system utilizes electroadhesive surfaces for braking and metering objects in an automated environment. An electroadhesive surface can include electrodes that are configured to induce an electrostatic attraction with nearby objects upon application of voltage to the electrodes. The systems described utilize various configurations of electroadhesive surfaces, sensors, controllers and programmable processors to create smart braking, capturing and metering systems for improved automated material handling.

Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.

Examples of the disclosure provide a system and method for autonomously opening bags using a mechanical arm. The mechanical arm includes actuators that move the mechanical arm in response to a trigger, a gripping component that attracts a portion of the bag in response to contact with the bag using a static electric charge, a nozzle that provides an introduction of compressed air into an environment relative to the opening of the bag, and a trigger mechanism that provides the trigger to the mechanical arm such that the mechanical arm brings the gripping component into contact with the bag using the one or more actuators and provides an expulsion of a portion of the compressed air via the nozzle to open the bag.

Dry adhesive microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.