A sheet material machining system includes a sheet material machining machine which is configured to machine a workpiece to produce a machined workpiece that includes a plurality of products and a residual material. The machined workpiece is configured to be placed on a sorting table. The plurality of products are configured to be placed on a temporary placement table. At least one product among the plurality of products are configured to be placed on a discharge table. A carrier includes an attracting actuator and a mobile actuator. The order management processor is configured to control the carrier and includes a storage configured to memorize a layout of the plurality of products in the workpiece. The plurality of products are associated with an attracting order.

Method of removing a target removable sheet part, in particular a product cutout, from a sheet using a remover, comprising the steps of: arranging the remover and the sheet relative to each other so that the plurality of actuators corresponds in position with the sheet, engaging the contact portions of at least one of a group of the plurality of actuators of which the position corresponds to a target removable sheet part of the sheet with the target removable sheet part, the at least one actuator being in its extended state; reconfiguring one or more of the engaged actuators of the group from its extended state to its retracted state with the target removable sheet part remaining engaged with the contact portion of said actuator to at least partially move the target removable sheet part from the sheet towards the carrier plane of the remover; moving the remover away from the sheet with the contact portions of said one or more the actuators of the group being engaged with the target removable sheet part, and performing an assisting operation with at least one actuator prior to the step of moving the remover away from the sheet.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

In some examples, a die-cutting machine includes a transport system configured as a chain gripper system. The chain gripper system includes a chain gripper carriage including a holding element for holding a sheet. The chain gripper carriage is arranged to be attached to at least one chain that is arranged to guide the chain gripper carriage on a guide path through at least part of the die-cutting machine. The chain gripper carriage includes a contact element functionally connected to the holding element. A chain gripper opener includes a contact surface at which, in the presence of the gripper carriage at the contact surface, the contact element cooperates with the chain gripper opener. The holding element is transferred at least from a closed position into an open position by cooperation of the chain gripper opener with the contact element. The chain gripper opener is adjustable by at least one drive.

The invention relates to a device for inserting a first ram (1) or a second ram (2) in an alternating manner into a ram feeder (3) of a device for inserting stripping pins and stripping claws into a stripping tool, wherein the first ram (1) and the second ram (2) are mounted on a retaining plate (6) so as to be moveable in a first movement direction (4), wherein the ram feeder (3) can be moved in a second movement direction (5), and wherein the first movement direction (4) is orthogonal to the second movement direction (5).

A layboy includes an upper belt section with a plurality of transversely spaced upper belts that extend in a longitudinal direction such that bottom portions of the upper belts lie in a first plane that defines an upper boundary of a transport path through the layboy and a lower belt section having a plurality of transversely spaced lower belts that extend in the longitudinal direction such that top portions of the lower belts lie in a second plane that defines an upper boundary of the transport path. The bottom portion of one of the top belts and/or the top portion of one of the bottom belts extends away from the transport path to define a gap in the transport path at which scrap moving through the layboy can fall out of the transport path.

An object is to collect a cut-off portion cut off from a workpiece with a simple structure. A workpiece switching jig 20 according to one aspect of the present disclosure is attachable to and detachable from a cutting machine 30 and holds a workpiece W to be cut by the cutting machine 30. The workpiece switching jig 20 includes a jig main body 21 configured to hold the workpiece W, a cut-off portion basket 25 configured to receive a cut-off portion W2 cut off from the workpiece W by the cutting machine 30, and an arm 23 configured to support the cut-off portion basket 25 with respect to the jig main body 21.

An object is to collect a cut-off portion cut off from a workpiece with a simple structure. A workpiece switching jig 20 according to one aspect of the present disclosure is attachable to and detachable from a cutting machine 30 and holds a workpiece W to be cut by the cutting machine 30. The workpiece switching jig 20 includes a jig main body 21 configured to hold the workpiece W, a cut-off portion basket 25 configured to receive a cut-off portion W2 cut off from the workpiece W by the cutting machine 30, and an arm 23 configured to support the cut-off portion basket 25 with respect to the jig main body 21.

A deburring apparatus includes (among other components) a frame and an elongated flat element connected to the frame. Rollers are adapted to support and rotate a vacuum belt around the apparatus. A perforation device is positioned and adapted to make perforations in the vacuum belt as the vacuum belt is rotated by the rollers. Making the perforations in the vacuum belt causes debris to remain in at least one of the perforations. The elongated flat element is positioned to contact the debris in the perforations.