In a stack of composite wood boards, the wood boards comprise wood particles and an organic binder.

In a stack of composite wood boards, the wood boards comprise wood particles and an organic binder.

The present disclosure provides for aqueous, curable binder compositions, as well as articles and products comprising assemblies of matter comprising mineral fibers, synthetic fibers, natural fibers, cellulosic particles and sheet materials comprising the binder compositions disclosed herein.

A plasterboard comprises a gypsum matrix having particles of agglomerated fibres embedded therein in an amount of at least 1 wt % relative to the gypsum, the gypsum matrix further comprising a polymeric additive, the polymeric additive being present in an amount of at least 1 wt % relative to the gypsum.

A method of producing wood-base panels, especially OSB wood-base panels is provided. The method including the steps of providing wood strands, applying at least one adhesive system to the wood strands having at least one polymer adhesive and at least one nanoparticle below 500 nm, and pressing the wood strands admixed with the adhesive system to form wood-base panels.

A formaldehyde free adhesive composition and a plywood obtained from the adhesive composition is provided, and the plywood has a balanced performance, such as high adhesion strength, sufficient pot-life, and good workability.

Disclosed herein are composite materials comprising a fibrous material and from 1% to 50% of a binding material, by weight of the composite material. Also disclosed herein are methods for making and using the same.

A binder has at least one isocyanate and at least one biopolymer mixed with water. The biopolymer may be a biopolymer nanoparticle or cooked and chemically modified starch. Optionally, the binder may also include urea. The biopolymer and water are mixed, and the isocyanate is added to the mixture. The binder may have a viscosity that is suitable for being sprayed on a substrate to make a composite material, for example a viscosity of 700 cP or less or 500 cP or less at 40° C. The substrate may be wood, another lignocellulosic material, or synthetic or natural fibers. In particular examples, the binder is used to make no added formaldehyde wood composites including particle board and fiberboard. Alternatively, the binder may have a higher viscosity and be used to make plywood.

The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali. The lignin prepared according to the process of the present invention can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.

A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.